JPS5794952U - - Google Patents
Info
- Publication number
- JPS5794952U JPS5794952U JP1980170913U JP17091380U JPS5794952U JP S5794952 U JPS5794952 U JP S5794952U JP 1980170913 U JP1980170913 U JP 1980170913U JP 17091380 U JP17091380 U JP 17091380U JP S5794952 U JPS5794952 U JP S5794952U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980170913U JPS5794952U (en) | 1980-12-01 | 1980-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980170913U JPS5794952U (en) | 1980-12-01 | 1980-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5794952U true JPS5794952U (en) | 1982-06-11 |
Family
ID=29529293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980170913U Pending JPS5794952U (en) | 1980-12-01 | 1980-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5794952U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142538U (en) * | 1989-04-28 | 1990-12-04 | ||
| JPH07115145A (en) * | 1993-10-15 | 1995-05-02 | Nec Corp | Semiconductor package |
-
1980
- 1980-12-01 JP JP1980170913U patent/JPS5794952U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142538U (en) * | 1989-04-28 | 1990-12-04 | ||
| JPH07115145A (en) * | 1993-10-15 | 1995-05-02 | Nec Corp | Semiconductor package |