JPS5793578A - Mos memory cell and method of producing same - Google Patents

Mos memory cell and method of producing same

Info

Publication number
JPS5793578A
JPS5793578A JP56162889A JP16288981A JPS5793578A JP S5793578 A JPS5793578 A JP S5793578A JP 56162889 A JP56162889 A JP 56162889A JP 16288981 A JP16288981 A JP 16288981A JP S5793578 A JPS5793578 A JP S5793578A
Authority
JP
Japan
Prior art keywords
memory cell
producing same
mos memory
mos
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56162889A
Other languages
Japanese (ja)
Inventor
Jiei Kooshiyu Jiyooji
Ei Horaa Maaku
Paaregosu Jiyooji
Gaagini Baoro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JPS5793578A publication Critical patent/JPS5793578A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7885—Hot carrier injection from the channel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
JP56162889A 1980-10-14 1981-10-14 Mos memory cell and method of producing same Pending JPS5793578A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/196,838 US4412310A (en) 1980-10-14 1980-10-14 EPROM Cell with reduced programming voltage and method of fabrication

Publications (1)

Publication Number Publication Date
JPS5793578A true JPS5793578A (en) 1982-06-10

Family

ID=22726978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56162889A Pending JPS5793578A (en) 1980-10-14 1981-10-14 Mos memory cell and method of producing same

Country Status (4)

Country Link
US (1) US4412310A (en)
JP (1) JPS5793578A (en)
DE (1) DE3139846A1 (en)
GB (1) GB2085226B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57157573A (en) * 1981-03-25 1982-09-29 Fujitsu Ltd Semiconductor non-volatile memory cell
DE3316096A1 (en) * 1983-05-03 1984-11-08 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING STORAGE CELLS WITH A FLOATING GATE MOS FIELD EFFECT TRANSISTOR
US4494301A (en) * 1983-09-01 1985-01-22 Rca Corporation Method of making semiconductor device with multi-levels of polycrystalline silicon conductors
JPS60234372A (en) * 1984-05-07 1985-11-21 Toshiba Corp Manufacture of semiconductor device
EP0160965B1 (en) * 1984-05-07 1990-01-31 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor device with a stacked-gate-electrode structure
FR2600810A1 (en) * 1986-06-27 1987-12-31 Eurotechnique Sa METHOD FOR PROGRAMMING DATA IN AN ELECTRICALLY PROGRAMMABLE DEAD MEMORY
KR920013709A (en) * 1990-12-21 1992-07-29 김광호 Nonvolatile semiconductor memory device and manufacturing method thereof
US5247477A (en) * 1991-05-31 1993-09-21 Altera Corporation Method of programming floating gate memory devices aided by potential applied to read channel
US5198381A (en) * 1991-09-12 1993-03-30 Vlsi Technology, Inc. Method of making an E2 PROM cell with improved tunneling properties having two implant stages
US5541876A (en) * 1994-06-01 1996-07-30 United Microelectronics Corporation Memory cell fabricated by floating gate structure
US5627091A (en) * 1994-06-01 1997-05-06 United Microelectronics Corporation Mask ROM process for making a ROM with a trench shaped channel
JP2929944B2 (en) * 1994-09-09 1999-08-03 株式会社デンソー Method for manufacturing semiconductor device
US5706227A (en) * 1995-12-07 1998-01-06 Programmable Microelectronics Corporation Double poly split gate PMOS flash memory cell
KR100252253B1 (en) * 1997-01-04 2000-05-01 윤종용 An electrically erasable programmble rom
US7030038B1 (en) * 1997-07-31 2006-04-18 Texas Instruments Incorporated Low temperature method for forming a thin, uniform oxide
KR100846392B1 (en) * 2006-08-31 2008-07-15 주식회사 하이닉스반도체 Semiconductor memory device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004159A (en) * 1973-05-18 1977-01-18 Sanyo Electric Co., Ltd. Electrically reprogrammable nonvolatile floating gate semi-conductor memory device and method of operation
US4016588A (en) * 1974-12-27 1977-04-05 Nippon Electric Company, Ltd. Non-volatile semiconductor memory device
US4203158A (en) * 1978-02-24 1980-05-13 Intel Corporation Electrically programmable and erasable MOS floating gate memory device employing tunneling and method of fabricating same
US4180826A (en) * 1978-05-19 1979-12-25 Intel Corporation MOS double polysilicon read-only memory and cell
JPS55113359A (en) * 1979-02-22 1980-09-01 Fujitsu Ltd Semiconductor integrated circuit device

Also Published As

Publication number Publication date
DE3139846A1 (en) 1982-06-16
DE3139846C2 (en) 1990-04-26
US4412310A (en) 1983-10-25
GB2085226B (en) 1985-08-21
GB2085226A (en) 1982-04-21

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