JPS5791253U - - Google Patents

Info

Publication number
JPS5791253U
JPS5791253U JP1980167626U JP16762680U JPS5791253U JP S5791253 U JPS5791253 U JP S5791253U JP 1980167626 U JP1980167626 U JP 1980167626U JP 16762680 U JP16762680 U JP 16762680U JP S5791253 U JPS5791253 U JP S5791253U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980167626U
Other languages
Japanese (ja)
Other versions
JPS6116699Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980167626U priority Critical patent/JPS6116699Y2/ja
Publication of JPS5791253U publication Critical patent/JPS5791253U/ja
Application granted granted Critical
Publication of JPS6116699Y2 publication Critical patent/JPS6116699Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1980167626U 1980-11-25 1980-11-25 Expired JPS6116699Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980167626U JPS6116699Y2 (enrdf_load_html_response) 1980-11-25 1980-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980167626U JPS6116699Y2 (enrdf_load_html_response) 1980-11-25 1980-11-25

Publications (2)

Publication Number Publication Date
JPS5791253U true JPS5791253U (enrdf_load_html_response) 1982-06-04
JPS6116699Y2 JPS6116699Y2 (enrdf_load_html_response) 1986-05-22

Family

ID=29526252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980167626U Expired JPS6116699Y2 (enrdf_load_html_response) 1980-11-25 1980-11-25

Country Status (1)

Country Link
JP (1) JPS6116699Y2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354758A (ja) * 1986-05-30 1988-03-09 デイジタル　イクイプメント　コ−ポレ−シヨン 一体形ヒ−トパイプモジュ−ル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354758A (ja) * 1986-05-30 1988-03-09 デイジタル　イクイプメント　コ−ポレ−シヨン 一体形ヒ−トパイプモジュ−ル

Also Published As

Publication number Publication date
JPS6116699Y2 (enrdf_load_html_response) 1986-05-22

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