JPS5788968U - - Google Patents
Info
- Publication number
- JPS5788968U JPS5788968U JP16620280U JP16620280U JPS5788968U JP S5788968 U JPS5788968 U JP S5788968U JP 16620280 U JP16620280 U JP 16620280U JP 16620280 U JP16620280 U JP 16620280U JP S5788968 U JPS5788968 U JP S5788968U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16620280U JPS5788968U (en) | 1980-11-21 | 1980-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16620280U JPS5788968U (en) | 1980-11-21 | 1980-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5788968U true JPS5788968U (en) | 1982-06-01 |
Family
ID=29524858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16620280U Pending JPS5788968U (en) | 1980-11-21 | 1980-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5788968U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016725A (en) * | 2006-07-07 | 2008-01-24 | Sharp Corp | Printed wiring board, method for mounting components thereof, and the board for mounting the electronic components |
| JP2016181574A (en) * | 2015-03-24 | 2016-10-13 | 京セラ株式会社 | Wiring board |
| WO2019159521A1 (en) * | 2018-02-15 | 2019-08-22 | 株式会社村田製作所 | Multilayer substrate and electric element |
| WO2020230778A1 (en) * | 2019-05-15 | 2020-11-19 | 株式会社村田製作所 | Multilayer resin substrate and electronic component |
-
1980
- 1980-11-21 JP JP16620280U patent/JPS5788968U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016725A (en) * | 2006-07-07 | 2008-01-24 | Sharp Corp | Printed wiring board, method for mounting components thereof, and the board for mounting the electronic components |
| JP2016181574A (en) * | 2015-03-24 | 2016-10-13 | 京セラ株式会社 | Wiring board |
| WO2019159521A1 (en) * | 2018-02-15 | 2019-08-22 | 株式会社村田製作所 | Multilayer substrate and electric element |
| JPWO2019159521A1 (en) * | 2018-02-15 | 2020-08-27 | 株式会社村田製作所 | Multilayer substrate and electric element |
| US11064606B2 (en) | 2018-02-15 | 2021-07-13 | Murata Manufacturing Co., Ltd. | Multilayer substrate and electric element |
| WO2020230778A1 (en) * | 2019-05-15 | 2020-11-19 | 株式会社村田製作所 | Multilayer resin substrate and electronic component |
| JPWO2020230778A1 (en) * | 2019-05-15 | 2020-11-19 |