JPS5784750U - - Google Patents
Info
- Publication number
- JPS5784750U JPS5784750U JP1980163066U JP16306680U JPS5784750U JP S5784750 U JPS5784750 U JP S5784750U JP 1980163066 U JP1980163066 U JP 1980163066U JP 16306680 U JP16306680 U JP 16306680U JP S5784750 U JPS5784750 U JP S5784750U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980163066U JPH0134351Y2 (cs) | 1980-11-14 | 1980-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980163066U JPH0134351Y2 (cs) | 1980-11-14 | 1980-11-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5784750U true JPS5784750U (cs) | 1982-05-25 |
| JPH0134351Y2 JPH0134351Y2 (cs) | 1989-10-19 |
Family
ID=29521873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980163066U Expired JPH0134351Y2 (cs) | 1980-11-14 | 1980-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0134351Y2 (cs) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59944A (ja) * | 1982-06-25 | 1984-01-06 | Agency Of Ind Science & Technol | 半導体装置 |
| JPS6059756A (ja) * | 1983-09-12 | 1985-04-06 | Ibiden Co Ltd | プラグインパッケ−ジとその製造方法 |
| JPS6095944A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
| JPS63100758A (ja) * | 1986-10-17 | 1988-05-02 | Toshiba Corp | 半導体外囲器 |
| JPH06177288A (ja) * | 1992-12-03 | 1994-06-24 | Nec Corp | 半導体装置 |
-
1980
- 1980-11-14 JP JP1980163066U patent/JPH0134351Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59944A (ja) * | 1982-06-25 | 1984-01-06 | Agency Of Ind Science & Technol | 半導体装置 |
| JPS6059756A (ja) * | 1983-09-12 | 1985-04-06 | Ibiden Co Ltd | プラグインパッケ−ジとその製造方法 |
| JPS6095944A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
| JPS63100758A (ja) * | 1986-10-17 | 1988-05-02 | Toshiba Corp | 半導体外囲器 |
| JPH06177288A (ja) * | 1992-12-03 | 1994-06-24 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0134351Y2 (cs) | 1989-10-19 |