JPS5780187U - - Google Patents
Info
- Publication number
- JPS5780187U JPS5780187U JP1980156727U JP15672780U JPS5780187U JP S5780187 U JPS5780187 U JP S5780187U JP 1980156727 U JP1980156727 U JP 1980156727U JP 15672780 U JP15672780 U JP 15672780U JP S5780187 U JPS5780187 U JP S5780187U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
- H10W72/527—Multiple bond wires having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Continuous-Control Power Sources That Use Transistors (AREA)
- Dc-Dc Converters (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980156727U JPS6241594Y2 (cg-RX-API-DMAC7.html) | 1980-10-31 | 1980-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980156727U JPS6241594Y2 (cg-RX-API-DMAC7.html) | 1980-10-31 | 1980-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5780187U true JPS5780187U (cg-RX-API-DMAC7.html) | 1982-05-18 |
| JPS6241594Y2 JPS6241594Y2 (cg-RX-API-DMAC7.html) | 1987-10-24 |
Family
ID=29515870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980156727U Expired JPS6241594Y2 (cg-RX-API-DMAC7.html) | 1980-10-31 | 1980-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6241594Y2 (cg-RX-API-DMAC7.html) |
-
1980
- 1980-10-31 JP JP1980156727U patent/JPS6241594Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6241594Y2 (cg-RX-API-DMAC7.html) | 1987-10-24 |