JPS5773062A - Preparation of water-soluble phenolic resin adhesive - Google Patents

Preparation of water-soluble phenolic resin adhesive

Info

Publication number
JPS5773062A
JPS5773062A JP14847480A JP14847480A JPS5773062A JP S5773062 A JPS5773062 A JP S5773062A JP 14847480 A JP14847480 A JP 14847480A JP 14847480 A JP14847480 A JP 14847480A JP S5773062 A JPS5773062 A JP S5773062A
Authority
JP
Japan
Prior art keywords
water
soluble
phenolic resin
containing compound
isocyanate group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14847480A
Other languages
Japanese (ja)
Inventor
Koji Higuchi
Jiro Nishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eidai Sangyo KK
Eidai Co Ltd
Original Assignee
Eidai Sangyo KK
Eidai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eidai Sangyo KK, Eidai Co Ltd filed Critical Eidai Sangyo KK
Priority to JP14847480A priority Critical patent/JPS5773062A/en
Publication of JPS5773062A publication Critical patent/JPS5773062A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

PURPOSE: To obtain the titled adhesive having a high curing rate, by adding an isocyanate group-containing compound alone to a water-soluble phnolic resin.
CONSTITUTION: A water-soluble phenolic resin (e.g., a common water-soluble resole by a catalyst of caustic soda) is blended with an isocyanate group-containing compound (its oligomer may be good) alone, and, if necessary, wheat flour, saw- dust, etc. with sufficient stirring at normal temperature, to give the desired adhesive.
EFFECT: Plywood and particle board can be prepared using wood veneer with high water content and chips at relatively low hot pressing temperature, and since no oily solvent is contained, storage and handling are easy, and the puncture of products caused by solvent will not take place.
COPYRIGHT: (C)1982,JPO&Japio
JP14847480A 1980-10-22 1980-10-22 Preparation of water-soluble phenolic resin adhesive Pending JPS5773062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14847480A JPS5773062A (en) 1980-10-22 1980-10-22 Preparation of water-soluble phenolic resin adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14847480A JPS5773062A (en) 1980-10-22 1980-10-22 Preparation of water-soluble phenolic resin adhesive

Publications (1)

Publication Number Publication Date
JPS5773062A true JPS5773062A (en) 1982-05-07

Family

ID=15453553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14847480A Pending JPS5773062A (en) 1980-10-22 1980-10-22 Preparation of water-soluble phenolic resin adhesive

Country Status (1)

Country Link
JP (1) JPS5773062A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000036019A1 (en) * 1998-12-17 2000-06-22 Bayer Corporation Mixed pmdi/resole resin binders for the production of wood composite products
US10889716B2 (en) * 2016-05-26 2021-01-12 Georgia-Pacific Chemicals Llc Binders containing an aldehyde-based resin and an isocyanate-based resin and methods for making composite lignocellulose products therefrom
US11780112B2 (en) 2016-05-26 2023-10-10 Bakelite Chemicals Llc Binders containing an aldehyde-based resin and an isocyanate-based resin and methods for making composite lignocellulose products therefrom

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329343A (en) * 1976-09-01 1978-03-18 Oshika Shinko Co Adhesive composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329343A (en) * 1976-09-01 1978-03-18 Oshika Shinko Co Adhesive composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000036019A1 (en) * 1998-12-17 2000-06-22 Bayer Corporation Mixed pmdi/resole resin binders for the production of wood composite products
US6214265B1 (en) 1998-12-17 2001-04-10 Bayer Corporation Mixed PMDI/resole resin binders for the production of wood composite products
AU752006B2 (en) * 1998-12-17 2002-09-05 Hexion Specialty Chemicals, Inc. Mixed PMDI/resole resin binders for the production of wood composite products
US6641761B2 (en) 1998-12-17 2003-11-04 Bayer Corporation Mixed PMDI/resole resin binders for the production of wood composite products
US10889716B2 (en) * 2016-05-26 2021-01-12 Georgia-Pacific Chemicals Llc Binders containing an aldehyde-based resin and an isocyanate-based resin and methods for making composite lignocellulose products therefrom
US11780112B2 (en) 2016-05-26 2023-10-10 Bakelite Chemicals Llc Binders containing an aldehyde-based resin and an isocyanate-based resin and methods for making composite lignocellulose products therefrom

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