JPS5771355U - - Google Patents

Info

Publication number
JPS5771355U
JPS5771355U JP1980147769U JP14776980U JPS5771355U JP S5771355 U JPS5771355 U JP S5771355U JP 1980147769 U JP1980147769 U JP 1980147769U JP 14776980 U JP14776980 U JP 14776980U JP S5771355 U JPS5771355 U JP S5771355U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980147769U
Other languages
Japanese (ja)
Other versions
JPS6240449Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980147769U priority Critical patent/JPS6240449Y2/ja
Publication of JPS5771355U publication Critical patent/JPS5771355U/ja
Application granted granted Critical
Publication of JPS6240449Y2 publication Critical patent/JPS6240449Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1980147769U 1980-10-16 1980-10-16 Expired JPS6240449Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980147769U JPS6240449Y2 (enrdf_load_stackoverflow) 1980-10-16 1980-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980147769U JPS6240449Y2 (enrdf_load_stackoverflow) 1980-10-16 1980-10-16

Publications (2)

Publication Number Publication Date
JPS5771355U true JPS5771355U (enrdf_load_stackoverflow) 1982-04-30
JPS6240449Y2 JPS6240449Y2 (enrdf_load_stackoverflow) 1987-10-16

Family

ID=29507261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980147769U Expired JPS6240449Y2 (enrdf_load_stackoverflow) 1980-10-16 1980-10-16

Country Status (1)

Country Link
JP (1) JPS6240449Y2 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636163U (enrdf_load_stackoverflow) * 1979-08-25 1981-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636163U (enrdf_load_stackoverflow) * 1979-08-25 1981-04-07

Also Published As

Publication number Publication date
JPS6240449Y2 (enrdf_load_stackoverflow) 1987-10-16

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