JPS5770169A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPS5770169A JPS5770169A JP14648880A JP14648880A JPS5770169A JP S5770169 A JPS5770169 A JP S5770169A JP 14648880 A JP14648880 A JP 14648880A JP 14648880 A JP14648880 A JP 14648880A JP S5770169 A JPS5770169 A JP S5770169A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- bond
- cyanoacrylate
- organosilicon
- variety
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: An adhesive with increased curing rate and improved wetting to a variety of materials, obtd. by incorporating an organosilicon compd. in an α-cyanoacrylate.
CONSTITUTION: One or several organosilicon compounds are incorporated in one or several α-cyanoacrylate. The organosilicon compd. to be use is a linear dihydoroxy-terminated siloxane of formulaI, a cyclic hydroxy siloxane compd. of formula II (wherein R1WR5 are each a saturated or unsaturated aliph. or arom. group; n is 0 or a number giving a viscosity ≤ about 100,000cSt, which is commonly recognized to exhibit solubility in a cyanoacrylate compound), hydroxy silicon compounds of formulas III and IV, those compd. in which the Si-O-Si bond is partially or entirely replaced by an Si-Si bond, etc. The adhesive composition obtd. is able to bond a variety of materials such as a porous material, polyester polyacetal or aluminum, which are conventionally beleieved to be inferior in adhesion and durability.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14648880A JPS5770169A (en) | 1980-10-20 | 1980-10-20 | Adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14648880A JPS5770169A (en) | 1980-10-20 | 1980-10-20 | Adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5770169A true JPS5770169A (en) | 1982-04-30 |
JPS6314755B2 JPS6314755B2 (en) | 1988-04-01 |
Family
ID=15408758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14648880A Granted JPS5770169A (en) | 1980-10-20 | 1980-10-20 | Adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5770169A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5770171A (en) * | 1980-10-21 | 1982-04-30 | Suriibondo:Kk | Adhesive composition |
JPH03126782A (en) * | 1989-10-12 | 1991-05-29 | Matsumoto Seiyaku Kogyo Kk | Cyanoacrylate adhesive composition |
US6183593B1 (en) | 1999-12-23 | 2001-02-06 | Closure Medical Corporation | 1,1-disubstituted ethylene adhesive compositions containing polydimethylsiloxane |
JP2001505235A (en) * | 1996-08-16 | 2001-04-17 | ロックタイト(アイルランド)リミテッド | Cyanoacrylate adhesive composition for glass bonding |
US6607631B1 (en) | 2000-09-08 | 2003-08-19 | Closure Medical Corporation | Adhesive compositions with reduced coefficient of friction |
WO2015033738A1 (en) * | 2013-09-03 | 2015-03-12 | 東亞合成株式会社 | Adhesive composition |
WO2016175204A1 (en) * | 2015-04-28 | 2016-11-03 | 東亞合成株式会社 | Curable composition and method for reinforcing shaped structure with use of same |
WO2017006799A1 (en) * | 2015-07-03 | 2017-01-12 | 東亞合成株式会社 | Adhesive composition |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880151A (en) * | 1972-01-21 | 1973-10-26 | ||
JPS48103633A (en) * | 1972-04-14 | 1973-12-26 |
-
1980
- 1980-10-20 JP JP14648880A patent/JPS5770169A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880151A (en) * | 1972-01-21 | 1973-10-26 | ||
JPS48103633A (en) * | 1972-04-14 | 1973-12-26 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5770171A (en) * | 1980-10-21 | 1982-04-30 | Suriibondo:Kk | Adhesive composition |
JPH0150268B2 (en) * | 1980-10-21 | 1989-10-27 | Three Bond Co Ltd | |
JPH03126782A (en) * | 1989-10-12 | 1991-05-29 | Matsumoto Seiyaku Kogyo Kk | Cyanoacrylate adhesive composition |
JP2001505235A (en) * | 1996-08-16 | 2001-04-17 | ロックタイト(アイルランド)リミテッド | Cyanoacrylate adhesive composition for glass bonding |
US6183593B1 (en) | 1999-12-23 | 2001-02-06 | Closure Medical Corporation | 1,1-disubstituted ethylene adhesive compositions containing polydimethylsiloxane |
WO2001046327A3 (en) * | 1999-12-23 | 2002-04-25 | Closure Medical Corp | 1,1-disubstituted ethylene adhesive compositions containing polydimethylsiloxane |
US6488944B2 (en) | 1999-12-23 | 2002-12-03 | Closure Medical Corporation | 1, 1-disubstituted ethylene adhesive compositions containing polydimethylsiloxane |
US6607631B1 (en) | 2000-09-08 | 2003-08-19 | Closure Medical Corporation | Adhesive compositions with reduced coefficient of friction |
WO2015033738A1 (en) * | 2013-09-03 | 2015-03-12 | 東亞合成株式会社 | Adhesive composition |
JPWO2015033738A1 (en) * | 2013-09-03 | 2017-03-02 | 東亞合成株式会社 | Adhesive composition |
US9683146B2 (en) | 2013-09-03 | 2017-06-20 | Toagosei Co., Ltd. | Adhesive composition |
WO2016175204A1 (en) * | 2015-04-28 | 2016-11-03 | 東亞合成株式会社 | Curable composition and method for reinforcing shaped structure with use of same |
CN107531814A (en) * | 2015-04-28 | 2018-01-02 | 东亚合成株式会社 | Solidification compound and the reinforcement means using its moulder |
JPWO2016175204A1 (en) * | 2015-04-28 | 2018-02-15 | 東亞合成株式会社 | Curable composition and method for reinforcing shaped article using the same |
US11066579B2 (en) | 2015-04-28 | 2021-07-20 | Toagosei Co., Ltd. | Curable composition and method for reinforcing shaped structure with use of same |
WO2017006799A1 (en) * | 2015-07-03 | 2017-01-12 | 東亞合成株式会社 | Adhesive composition |
JPWO2017006799A1 (en) * | 2015-07-03 | 2018-06-14 | 東亞合成株式会社 | Adhesive composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6314755B2 (en) | 1988-04-01 |
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