JPS5765716A - Curing of thermosetting resin composition - Google Patents

Curing of thermosetting resin composition

Info

Publication number
JPS5765716A
JPS5765716A JP14089080A JP14089080A JPS5765716A JP S5765716 A JPS5765716 A JP S5765716A JP 14089080 A JP14089080 A JP 14089080A JP 14089080 A JP14089080 A JP 14089080A JP S5765716 A JPS5765716 A JP S5765716A
Authority
JP
Japan
Prior art keywords
curing
prepolymer
resin composition
thermosetting resin
10w50pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14089080A
Other languages
Japanese (ja)
Inventor
Kaoru Kanayama
Yoshinobu Onuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP14089080A priority Critical patent/JPS5765716A/en
Publication of JPS5765716A publication Critical patent/JPS5765716A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a cured product with good operability, by reacting, in turn, a monoepoxide and a polyepoxide with a phenol/dialdehyde condensate, adding hexamethylenetetramine to the resulting prepolymer and heating and curing the mixture.
CONSTITUTION: 10W50pts.wt. monoepoxy compound, e.g., styrene oxide, is reacted with 100pts.wt. condensate between a phenol and a dialdehyde selected from the group consisting of glyoxal, glutaraldehyde and terephthaladehyde in the presence of 0.1W5pts.wt. curing catalyst, e.g., tetraethylammonium chloride. Then, the produced compound is reacted with 10W50pts.wt. polyepoxy compound, e.g., glycidyl ether of bisphenol A, to produce a prepolymer. This prepolymer (100pts. wt.) is mixed with 5W30pts.wt. hexamethylenetetramine and cured by heating.
COPYRIGHT: (C)1982,JPO&Japio
JP14089080A 1980-10-08 1980-10-08 Curing of thermosetting resin composition Pending JPS5765716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14089080A JPS5765716A (en) 1980-10-08 1980-10-08 Curing of thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14089080A JPS5765716A (en) 1980-10-08 1980-10-08 Curing of thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5765716A true JPS5765716A (en) 1982-04-21

Family

ID=15279159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14089080A Pending JPS5765716A (en) 1980-10-08 1980-10-08 Curing of thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5765716A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099117A (en) * 1983-11-02 1985-06-03 Sumitomo Bakelite Co Ltd Thermosetting resin composition
US5354788A (en) * 1992-03-27 1994-10-11 Borden, Inc. Dialdehyde modified phenolic foundry sand core binder resins, processes for making same, and process for preparing foundry cores and molds employing same
WO2000017243A1 (en) * 1998-09-22 2000-03-30 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
WO2007119402A1 (en) 2006-03-17 2007-10-25 Nippon Soda Co., Ltd. Method for producing 1,2-phenylethane compound using atom transfer radical coupling reaction
WO2010050592A1 (en) * 2008-10-31 2010-05-06 独立行政法人国立高等専門学校機構 Phenol resin for photoresist, photoresist composition containing same, and method for producing same
JPWO2018105346A1 (en) * 2016-12-08 2019-03-22 Dic株式会社 Phenolic hydroxyl group-containing resin and resist material

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099117A (en) * 1983-11-02 1985-06-03 Sumitomo Bakelite Co Ltd Thermosetting resin composition
US5354788A (en) * 1992-03-27 1994-10-11 Borden, Inc. Dialdehyde modified phenolic foundry sand core binder resins, processes for making same, and process for preparing foundry cores and molds employing same
WO2000017243A1 (en) * 1998-09-22 2000-03-30 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
WO2007119402A1 (en) 2006-03-17 2007-10-25 Nippon Soda Co., Ltd. Method for producing 1,2-phenylethane compound using atom transfer radical coupling reaction
US8034971B2 (en) 2006-03-17 2011-10-11 Nippon Soda Co., Ltd. Method for producing 1,2-phenylethane compound using atom transfer radical coupling reaction
WO2010050592A1 (en) * 2008-10-31 2010-05-06 独立行政法人国立高等専門学校機構 Phenol resin for photoresist, photoresist composition containing same, and method for producing same
JP5625192B2 (en) * 2008-10-31 2014-11-19 独立行政法人国立高等専門学校機構 Photoresist composition
JPWO2018105346A1 (en) * 2016-12-08 2019-03-22 Dic株式会社 Phenolic hydroxyl group-containing resin and resist material

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