JPS576277U - - Google Patents
Info
- Publication number
- JPS576277U JPS576277U JP8279080U JP8279080U JPS576277U JP S576277 U JPS576277 U JP S576277U JP 8279080 U JP8279080 U JP 8279080U JP 8279080 U JP8279080 U JP 8279080U JP S576277 U JPS576277 U JP S576277U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8279080U JPS576277U (en) | 1980-06-12 | 1980-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8279080U JPS576277U (en) | 1980-06-12 | 1980-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS576277U true JPS576277U (en) | 1982-01-13 |
Family
ID=29445134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8279080U Pending JPS576277U (en) | 1980-06-12 | 1980-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS576277U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191494A (en) * | 1982-04-21 | 1983-11-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Part placing method and device |
| WO2007099873A1 (en) * | 2006-02-28 | 2007-09-07 | Kabushiki Kaisha Toyota Jidoshokki | Method and apparatus for mounting electronic component and semiconductor device manufacturing method |
-
1980
- 1980-06-12 JP JP8279080U patent/JPS576277U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191494A (en) * | 1982-04-21 | 1983-11-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Part placing method and device |
| WO2007099873A1 (en) * | 2006-02-28 | 2007-09-07 | Kabushiki Kaisha Toyota Jidoshokki | Method and apparatus for mounting electronic component and semiconductor device manufacturing method |