JPS576253U - - Google Patents

Info

Publication number
JPS576253U
JPS576253U JP1980082737U JP8273780U JPS576253U JP S576253 U JPS576253 U JP S576253U JP 1980082737 U JP1980082737 U JP 1980082737U JP 8273780 U JP8273780 U JP 8273780U JP S576253 U JPS576253 U JP S576253U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980082737U
Other languages
Japanese (ja)
Other versions
JPS6120781Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980082737U priority Critical patent/JPS6120781Y2/ja
Publication of JPS576253U publication Critical patent/JPS576253U/ja
Application granted granted Critical
Publication of JPS6120781Y2 publication Critical patent/JPS6120781Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP1980082737U 1980-06-13 1980-06-13 Expired JPS6120781Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980082737U JPS6120781Y2 (enExample) 1980-06-13 1980-06-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980082737U JPS6120781Y2 (enExample) 1980-06-13 1980-06-13

Publications (2)

Publication Number Publication Date
JPS576253U true JPS576253U (enExample) 1982-01-13
JPS6120781Y2 JPS6120781Y2 (enExample) 1986-06-21

Family

ID=29445082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980082737U Expired JPS6120781Y2 (enExample) 1980-06-13 1980-06-13

Country Status (1)

Country Link
JP (1) JPS6120781Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119760A (ja) * 1986-05-09 1988-05-24 中村　俊郎 足関節装具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173977U (enExample) * 1974-12-05 1976-06-10
JPS5250060U (enExample) * 1975-10-07 1977-04-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173977U (enExample) * 1974-12-05 1976-06-10
JPS5250060U (enExample) * 1975-10-07 1977-04-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119760A (ja) * 1986-05-09 1988-05-24 中村　俊郎 足関節装具

Also Published As

Publication number Publication date
JPS6120781Y2 (enExample) 1986-06-21

Similar Documents

Publication Publication Date Title
FR2482967B1 (enExample)
FR2473983B1 (enExample)
IN152440B (enExample)
FR2473132B1 (enExample)
CH655418B (enExample)
CH663130GA3 (enExample)
FR2473810B1 (enExample)
FR2473343B1 (enExample)
CH655684B (enExample)
FR2473051B1 (enExample)
FR2477287B2 (enExample)
FR2473766B1 (enExample)
FR2473852B1 (enExample)
DE3152398T1 (enExample)
FR2473224B1 (enExample)
FR2473388B1 (enExample)
FR2473842B1 (enExample)
FR2473924B1 (enExample)
FR2473749B1 (enExample)
FR2478929B1 (enExample)
DE3029945C2 (enExample)
CH655427B (enExample)
FR2473161B1 (enExample)
CH627612GA3 (enExample)
FR2473166B1 (enExample)