JPS576253U - - Google Patents

Info

Publication number
JPS576253U
JPS576253U JP1980082737U JP8273780U JPS576253U JP S576253 U JPS576253 U JP S576253U JP 1980082737 U JP1980082737 U JP 1980082737U JP 8273780 U JP8273780 U JP 8273780U JP S576253 U JPS576253 U JP S576253U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980082737U
Other languages
Japanese (ja)
Other versions
JPS6120781Y2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980082737U priority Critical patent/JPS6120781Y2/ja
Publication of JPS576253U publication Critical patent/JPS576253U/ja
Application granted granted Critical
Publication of JPS6120781Y2 publication Critical patent/JPS6120781Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP1980082737U 1980-06-13 1980-06-13 Expired JPS6120781Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980082737U JPS6120781Y2 (cg-RX-API-DMAC10.html) 1980-06-13 1980-06-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980082737U JPS6120781Y2 (cg-RX-API-DMAC10.html) 1980-06-13 1980-06-13

Publications (2)

Publication Number Publication Date
JPS576253U true JPS576253U (cg-RX-API-DMAC10.html) 1982-01-13
JPS6120781Y2 JPS6120781Y2 (cg-RX-API-DMAC10.html) 1986-06-21

Family

ID=29445082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980082737U Expired JPS6120781Y2 (cg-RX-API-DMAC10.html) 1980-06-13 1980-06-13

Country Status (1)

Country Link
JP (1) JPS6120781Y2 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119760A (ja) * 1986-05-09 1988-05-24 中村　俊郎 足関節装具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173977U (cg-RX-API-DMAC10.html) * 1974-12-05 1976-06-10
JPS5250060U (cg-RX-API-DMAC10.html) * 1975-10-07 1977-04-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173977U (cg-RX-API-DMAC10.html) * 1974-12-05 1976-06-10
JPS5250060U (cg-RX-API-DMAC10.html) * 1975-10-07 1977-04-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119760A (ja) * 1986-05-09 1988-05-24 中村　俊郎 足関節装具

Also Published As

Publication number Publication date
JPS6120781Y2 (cg-RX-API-DMAC10.html) 1986-06-21

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