Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa LtdfiledCriticalShinkawa Ltd
Priority to JP11442377ApriorityCriticalpatent/JPS5448159A/ja
Publication of JPS5448159ApublicationCriticalpatent/JPS5448159A/ja
Publication of JPS5760210B2publicationCriticalpatent/JPS5760210B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/78—Apparatus for connecting with wire connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/78—Apparatus for connecting with wire connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
Engineering & Computer Science
(AREA)
Manufacturing & Machinery
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Wire Bonding
(AREA)
Container Filling Or Packaging Operations
(AREA)
JP11442377A1977-09-231977-09-23Wire bonding unit with container
GrantedJPS5448159A
(en)