JPS5759446U - - Google Patents
Info
- Publication number
- JPS5759446U JPS5759446U JP13553280U JP13553280U JPS5759446U JP S5759446 U JPS5759446 U JP S5759446U JP 13553280 U JP13553280 U JP 13553280U JP 13553280 U JP13553280 U JP 13553280U JP S5759446 U JPS5759446 U JP S5759446U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13553280U JPS5759446U (enrdf_load_stackoverflow) | 1980-09-24 | 1980-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13553280U JPS5759446U (enrdf_load_stackoverflow) | 1980-09-24 | 1980-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5759446U true JPS5759446U (enrdf_load_stackoverflow) | 1982-04-08 |
Family
ID=29495694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13553280U Pending JPS5759446U (enrdf_load_stackoverflow) | 1980-09-24 | 1980-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5759446U (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63123409U (enrdf_load_stackoverflow) * | 1987-02-05 | 1988-08-11 | ||
| JPH01153439A (ja) * | 1987-12-01 | 1989-06-15 | Takagi Ind Co Ltd | 結束材除去装置 |
-
1980
- 1980-09-24 JP JP13553280U patent/JPS5759446U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63123409U (enrdf_load_stackoverflow) * | 1987-02-05 | 1988-08-11 | ||
| JPH01153439A (ja) * | 1987-12-01 | 1989-06-15 | Takagi Ind Co Ltd | 結束材除去装置 |