JPS5759029B2 - - Google Patents
Info
- Publication number
- JPS5759029B2 JPS5759029B2 JP1344274A JP1344274A JPS5759029B2 JP S5759029 B2 JPS5759029 B2 JP S5759029B2 JP 1344274 A JP1344274 A JP 1344274A JP 1344274 A JP1344274 A JP 1344274A JP S5759029 B2 JPS5759029 B2 JP S5759029B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Arc Welding Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1344274A JPS5759029B2 (hu) | 1974-01-30 | 1974-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1344274A JPS5759029B2 (hu) | 1974-01-30 | 1974-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50106838A JPS50106838A (hu) | 1975-08-22 |
| JPS5759029B2 true JPS5759029B2 (hu) | 1982-12-13 |
Family
ID=11833237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1344274A Expired JPS5759029B2 (hu) | 1974-01-30 | 1974-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5759029B2 (hu) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10714438B2 (en) | 2018-01-03 | 2020-07-14 | Samsung Electronics Co., Ltd. | Semiconductor device having metal bump and method of manufacturing the same |
-
1974
- 1974-01-30 JP JP1344274A patent/JPS5759029B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10714438B2 (en) | 2018-01-03 | 2020-07-14 | Samsung Electronics Co., Ltd. | Semiconductor device having metal bump and method of manufacturing the same |
| US11037894B2 (en) | 2018-01-03 | 2021-06-15 | Samsung Electronics Co., Ltd. | Semiconductor device having metal bump and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50106838A (hu) | 1975-08-22 |