JPS5758800B2 - - Google Patents

Info

Publication number
JPS5758800B2
JPS5758800B2 JP51014152A JP1415276A JPS5758800B2 JP S5758800 B2 JPS5758800 B2 JP S5758800B2 JP 51014152 A JP51014152 A JP 51014152A JP 1415276 A JP1415276 A JP 1415276A JP S5758800 B2 JPS5758800 B2 JP S5758800B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51014152A
Other languages
Japanese (ja)
Other versions
JPS5297166A (en
Inventor
Shoji Nakakita
Masaji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP1415276A priority Critical patent/JPS5297166A/ja
Publication of JPS5297166A publication Critical patent/JPS5297166A/ja
Publication of JPS5758800B2 publication Critical patent/JPS5758800B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1415276A 1976-02-10 1976-02-10 Method of producing thick multilayer circuit substrate Granted JPS5297166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1415276A JPS5297166A (en) 1976-02-10 1976-02-10 Method of producing thick multilayer circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1415276A JPS5297166A (en) 1976-02-10 1976-02-10 Method of producing thick multilayer circuit substrate

Publications (2)

Publication Number Publication Date
JPS5297166A JPS5297166A (en) 1977-08-15
JPS5758800B2 true JPS5758800B2 (fr) 1982-12-11

Family

ID=11853168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1415276A Granted JPS5297166A (en) 1976-02-10 1976-02-10 Method of producing thick multilayer circuit substrate

Country Status (1)

Country Link
JP (1) JPS5297166A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157276A (en) * 1978-06-01 1979-12-12 Nippon Electric Co Method of making thick film circuit pattern for microwave integrated circuit
JPS5533063A (en) * 1978-08-29 1980-03-08 Nippon Electric Co Method of manufacturing high packing density mounted substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4730136U (fr) * 1971-05-06 1972-12-05
JPS4945909A (fr) * 1972-08-04 1974-05-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4730136U (fr) * 1971-05-06 1972-12-05
JPS4945909A (fr) * 1972-08-04 1974-05-02

Also Published As

Publication number Publication date
JPS5297166A (en) 1977-08-15

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