JPS5758789Y2 - - Google Patents
Info
- Publication number
- JPS5758789Y2 JPS5758789Y2 JP1975083446U JP8344675U JPS5758789Y2 JP S5758789 Y2 JPS5758789 Y2 JP S5758789Y2 JP 1975083446 U JP1975083446 U JP 1975083446U JP 8344675 U JP8344675 U JP 8344675U JP S5758789 Y2 JPS5758789 Y2 JP S5758789Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975083446U JPS5758789Y2 (cs) | 1975-06-20 | 1975-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975083446U JPS5758789Y2 (cs) | 1975-06-20 | 1975-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51162962U JPS51162962U (cs) | 1976-12-25 |
| JPS5758789Y2 true JPS5758789Y2 (cs) | 1982-12-15 |
Family
ID=28564799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975083446U Expired JPS5758789Y2 (cs) | 1975-06-20 | 1975-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5758789Y2 (cs) |
-
1975
- 1975-06-20 JP JP1975083446U patent/JPS5758789Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51162962U (cs) | 1976-12-25 |