JPS5758789Y2 - - Google Patents

Info

Publication number
JPS5758789Y2
JPS5758789Y2 JP1975083446U JP8344675U JPS5758789Y2 JP S5758789 Y2 JPS5758789 Y2 JP S5758789Y2 JP 1975083446 U JP1975083446 U JP 1975083446U JP 8344675 U JP8344675 U JP 8344675U JP S5758789 Y2 JPS5758789 Y2 JP S5758789Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975083446U
Other languages
Japanese (ja)
Other versions
JPS51162962U (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975083446U priority Critical patent/JPS5758789Y2/ja
Publication of JPS51162962U publication Critical patent/JPS51162962U/ja
Application granted granted Critical
Publication of JPS5758789Y2 publication Critical patent/JPS5758789Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1975083446U 1975-06-20 1975-06-20 Expired JPS5758789Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975083446U JPS5758789Y2 (cg-RX-API-DMAC7.html) 1975-06-20 1975-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975083446U JPS5758789Y2 (cg-RX-API-DMAC7.html) 1975-06-20 1975-06-20

Publications (2)

Publication Number Publication Date
JPS51162962U JPS51162962U (cg-RX-API-DMAC7.html) 1976-12-25
JPS5758789Y2 true JPS5758789Y2 (cg-RX-API-DMAC7.html) 1982-12-15

Family

ID=28564799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975083446U Expired JPS5758789Y2 (cg-RX-API-DMAC7.html) 1975-06-20 1975-06-20

Country Status (1)

Country Link
JP (1) JPS5758789Y2 (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPS51162962U (cg-RX-API-DMAC7.html) 1976-12-25

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