JPS5758783B2 - - Google Patents

Info

Publication number
JPS5758783B2
JPS5758783B2 JP2186473A JP2186473A JPS5758783B2 JP S5758783 B2 JPS5758783 B2 JP S5758783B2 JP 2186473 A JP2186473 A JP 2186473A JP 2186473 A JP2186473 A JP 2186473A JP S5758783 B2 JPS5758783 B2 JP S5758783B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2186473A
Other languages
Japanese (ja)
Other versions
JPS49111583A (enFirst
Inventor
Shinzo Anazawa
Seiichi Ueno
Isamu Nagasako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP2186473A priority Critical patent/JPS5758783B2/ja
Priority to US44434774 priority patent/US3893193A/en
Publication of JPS49111583A publication Critical patent/JPS49111583A/ja
Publication of JPS5758783B2 publication Critical patent/JPS5758783B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP2186473A 1973-02-22 1973-02-22 Expired JPS5758783B2 (enFirst)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2186473A JPS5758783B2 (enFirst) 1973-02-22 1973-02-22
US44434774 US3893193A (en) 1973-02-22 1974-02-21 Hermetically housed electrical component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2186473A JPS5758783B2 (enFirst) 1973-02-22 1973-02-22

Publications (2)

Publication Number Publication Date
JPS49111583A JPS49111583A (enFirst) 1974-10-24
JPS5758783B2 true JPS5758783B2 (enFirst) 1982-12-11

Family

ID=12066973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2186473A Expired JPS5758783B2 (enFirst) 1973-02-22 1973-02-22

Country Status (2)

Country Link
US (1) US3893193A (enFirst)
JP (1) JPS5758783B2 (enFirst)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282597A (en) * 1977-11-28 1981-08-04 Texas Instruments Incorporated Metal-coated plastic housing for electronic components and the method of making same
JPS57162451A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Semiconductor device
US4571277A (en) * 1982-03-24 1986-02-18 An-Rix, Inc. Cold recapping method for tires utilizing uncured rubber and compressible mold
US4689583A (en) * 1984-02-13 1987-08-25 Raytheon Company Dual diode module with heat sink, for use in a cavity power combiner
EP0162521A3 (en) * 1984-05-23 1986-10-08 American Microsystems, Incorporated Package for semiconductor devices
CA1264380A (en) * 1985-01-30 1990-01-09 Jun Fukaya Semiconductor device package with integral earth lead and side wall
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
EP0408636A4 (en) * 1988-03-23 1992-01-02 Robert Ferrand Patient support system
ATE474366T1 (de) * 2005-09-24 2010-07-15 Grundfos Management As Spaltrohr

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202925C (enFirst) * 1969-04-30 1900-01-01
US3502786A (en) * 1967-06-14 1970-03-24 Milton Stoll Flat pack spacer of low thermal diffusivity
US3801938A (en) * 1972-05-31 1974-04-02 Trw Inc Package for microwave semiconductor device

Also Published As

Publication number Publication date
US3893193A (en) 1975-07-01
JPS49111583A (enFirst) 1974-10-24

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