JPS5758060B2 - - Google Patents

Info

Publication number
JPS5758060B2
JPS5758060B2 JP52034857A JP3485777A JPS5758060B2 JP S5758060 B2 JPS5758060 B2 JP S5758060B2 JP 52034857 A JP52034857 A JP 52034857A JP 3485777 A JP3485777 A JP 3485777A JP S5758060 B2 JPS5758060 B2 JP S5758060B2
Authority
JP
Japan
Prior art keywords
lead wires
heat sink
detach
buried
placing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52034857A
Other languages
Japanese (ja)
Other versions
JPS53119673A (en
Inventor
Taku Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Nippon Electric Co Ltd
Original Assignee
New Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Nippon Electric Co Ltd filed Critical New Nippon Electric Co Ltd
Priority to JP3485777A priority Critical patent/JPS53119673A/en
Publication of JPS53119673A publication Critical patent/JPS53119673A/en
Publication of JPS5758060B2 publication Critical patent/JPS5758060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate bonding operation by placing a plurality of lead wires on a heat sink mounted with an element, connecting the respective electrodes of the element and lead wires, thereafter letting the expandable insulator having been buried in the heat sink or lead wires expand to detach the respective lead wires from the heat sink.
JP3485777A 1977-03-28 1977-03-28 Production of semiconductor device Granted JPS53119673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3485777A JPS53119673A (en) 1977-03-28 1977-03-28 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3485777A JPS53119673A (en) 1977-03-28 1977-03-28 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53119673A JPS53119673A (en) 1978-10-19
JPS5758060B2 true JPS5758060B2 (en) 1982-12-08

Family

ID=12425836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3485777A Granted JPS53119673A (en) 1977-03-28 1977-03-28 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53119673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332949Y2 (en) * 1985-02-14 1991-07-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332949Y2 (en) * 1985-02-14 1991-07-12

Also Published As

Publication number Publication date
JPS53119673A (en) 1978-10-19

Similar Documents

Publication Publication Date Title
NL7811896A (en) ELECTRICAL CONNECTION DEVICE.
NL7807769A (en) ELECTRICAL CONNECTION DEVICE.
NL7807715A (en) ELECTRICAL CONNECTION DEVICE.
NL184401C (en) ELECTRICAL CONNECTION DEVICE.
NL7708271A (en) ELECTRICAL CONNECTION DEVICE.
ES228466Y (en) AN ELECTRICAL TERMINAL.
NO153159C (en) ELECTRICAL CONNECTING DEVICE.
NL7712635A (en) ELECTRICAL CONNECTING DEVICE.
NO772894L (en) ELECTRICAL CONNECTION.
NL7808126A (en) ELECTRICAL ENERGY SUPPLY DEVICE.
NL7600420A (en) ELECTRICAL DISCHARGE DEVICE.
NL186354C (en) SEMICONDUCTOR DEVICE COMPRISING III-V CONNECTIONS WITH A COMPOSITE ELECTRODE.
NL7710474A (en) ELECTRICAL CONNECTION DEVICE.
NL7708638A (en) ELECTRICAL CONNECTING DEVICE.
NL7600422A (en) ELECTRICAL DISCHARGE DEVICE.
NL7900542A (en) ELECTRICAL CONNECTING DEVICE.
NL7701039A (en) ELECTRICAL REGULATOR.
NL183157C (en) ELECTRICAL CONNECTION DEVICE.
JPS5758060B2 (en)
JPS5357971A (en) Production of semiconductor device
NL7710794A (en) ELECTRICAL DEVICE.
NL7707454A (en) ELECTRICAL CIRCUIT.
NL184034C (en) ELECTRICAL CONNECTION.
NL7712036A (en) ELECTRICAL POWER SUPPLY SYSTEM.
NL7811686A (en) ELECTRICAL CONNECTION DEVICE.