JPS5758049B2 - - Google Patents
Info
- Publication number
- JPS5758049B2 JPS5758049B2 JP51055129A JP5512976A JPS5758049B2 JP S5758049 B2 JPS5758049 B2 JP S5758049B2 JP 51055129 A JP51055129 A JP 51055129A JP 5512976 A JP5512976 A JP 5512976A JP S5758049 B2 JPS5758049 B2 JP S5758049B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5512976A JPS52137983A (en) | 1976-05-14 | 1976-05-14 | Mounting method of semiconductor tip by tapeecarrier system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5512976A JPS52137983A (en) | 1976-05-14 | 1976-05-14 | Mounting method of semiconductor tip by tapeecarrier system |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52137983A JPS52137983A (en) | 1977-11-17 |
JPS5758049B2 true JPS5758049B2 (enrdf_load_stackoverflow) | 1982-12-08 |
Family
ID=12990149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5512976A Granted JPS52137983A (en) | 1976-05-14 | 1976-05-14 | Mounting method of semiconductor tip by tapeecarrier system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52137983A (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5552229A (en) * | 1978-10-11 | 1980-04-16 | Nec Corp | Manufacture of semiconductor device |
JPS56103434A (en) * | 1980-01-23 | 1981-08-18 | Hitachi Ltd | Automatic wire bonding |
JPS5818933A (ja) * | 1981-07-27 | 1983-02-03 | Shinkawa Ltd | インナ−リ−ドボンデイング装置 |
JPS5864157A (ja) * | 1981-10-13 | 1983-04-16 | Toyota Motor Corp | 自動水研装置 |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
US10141215B2 (en) | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153872A (enrdf_load_stackoverflow) * | 1974-05-30 | 1975-12-11 |
-
1976
- 1976-05-14 JP JP5512976A patent/JPS52137983A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS52137983A (en) | 1977-11-17 |