JPS5756523Y2 - - Google Patents
Info
- Publication number
- JPS5756523Y2 JPS5756523Y2 JP1977106496U JP10649677U JPS5756523Y2 JP S5756523 Y2 JPS5756523 Y2 JP S5756523Y2 JP 1977106496 U JP1977106496 U JP 1977106496U JP 10649677 U JP10649677 U JP 10649677U JP S5756523 Y2 JPS5756523 Y2 JP S5756523Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977106496U JPS5756523Y2 (https=) | 1977-08-08 | 1977-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977106496U JPS5756523Y2 (https=) | 1977-08-08 | 1977-08-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5433060U JPS5433060U (https=) | 1979-03-03 |
| JPS5756523Y2 true JPS5756523Y2 (https=) | 1982-12-04 |
Family
ID=29049726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977106496U Expired JPS5756523Y2 (https=) | 1977-08-08 | 1977-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5756523Y2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6085066U (ja) * | 1983-11-18 | 1985-06-12 | 株式会社日立製作所 | 電池収納装置 |
| JPH0518849Y2 (https=) * | 1986-08-28 | 1993-05-19 | ||
| JPH0454684Y2 (https=) * | 1986-08-28 | 1992-12-22 | ||
| JPH0454686Y2 (https=) * | 1986-08-28 | 1992-12-22 | ||
| JPH0454689Y2 (https=) * | 1986-09-01 | 1992-12-22 |
-
1977
- 1977-08-08 JP JP1977106496U patent/JPS5756523Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5433060U (https=) | 1979-03-03 |