JPS5756512Y2 - - Google Patents
Info
- Publication number
- JPS5756512Y2 JPS5756512Y2 JP1975171469U JP17146975U JPS5756512Y2 JP S5756512 Y2 JPS5756512 Y2 JP S5756512Y2 JP 1975171469 U JP1975171469 U JP 1975171469U JP 17146975 U JP17146975 U JP 17146975U JP S5756512 Y2 JPS5756512 Y2 JP S5756512Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975171469U JPS5756512Y2 (en:Method) | 1975-12-18 | 1975-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975171469U JPS5756512Y2 (en:Method) | 1975-12-18 | 1975-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5283662U JPS5283662U (en:Method) | 1977-06-22 |
| JPS5756512Y2 true JPS5756512Y2 (en:Method) | 1982-12-04 |
Family
ID=28649930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975171469U Expired JPS5756512Y2 (en:Method) | 1975-12-18 | 1975-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5756512Y2 (en:Method) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5531822Y2 (en:Method) * | 1974-12-05 | 1980-07-29 |
-
1975
- 1975-12-18 JP JP1975171469U patent/JPS5756512Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5283662U (en:Method) | 1977-06-22 |