JPS5755005A - Thick film conductor using copper oxide - Google Patents

Thick film conductor using copper oxide

Info

Publication number
JPS5755005A
JPS5755005A JP56128283A JP12828381A JPS5755005A JP S5755005 A JPS5755005 A JP S5755005A JP 56128283 A JP56128283 A JP 56128283A JP 12828381 A JP12828381 A JP 12828381A JP S5755005 A JPS5755005 A JP S5755005A
Authority
JP
Japan
Prior art keywords
thick film
copper oxide
film conductor
conductor
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56128283A
Other languages
English (en)
Inventor
Deyuan Purobuansu Jieison
Uoren Arison Kebuin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vibrantz Corp
Original Assignee
Ferro Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferro Corp filed Critical Ferro Corp
Publication of JPS5755005A publication Critical patent/JPS5755005A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
JP56128283A 1980-08-22 1981-08-18 Thick film conductor using copper oxide Pending JPS5755005A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/180,298 US4322316A (en) 1980-08-22 1980-08-22 Thick film conductor employing copper oxide

Publications (1)

Publication Number Publication Date
JPS5755005A true JPS5755005A (en) 1982-04-01

Family

ID=22659937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56128283A Pending JPS5755005A (en) 1980-08-22 1981-08-18 Thick film conductor using copper oxide

Country Status (4)

Country Link
US (1) US4322316A (ja)
EP (1) EP0046640B1 (ja)
JP (1) JPS5755005A (ja)
DE (1) DE3167701D1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894184A (en) * 1986-08-27 1990-01-16 The Furukawa Electric Co., Ltd. Low-temperature burnt conductive paste and method of manufacturing printed circuit board

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4388347A (en) * 1980-11-11 1983-06-14 Uop Inc. Conductive pigment-coated surfaces
US4410574A (en) * 1981-05-22 1983-10-18 Xexex Industries, Inc. Printed circuit boards and methods for making same
FR2516739A1 (fr) * 1981-11-17 1983-05-20 Rhone Poulenc Spec Chim Procede de fabrication de circuits electroniques de type hybride a couches epaisses, des moyens destines a la mise en oeuvre de ce procede et les circuits obtenus selon ce procede
US4567111A (en) * 1982-11-04 1986-01-28 Uop Inc. Conductive pigment-coated surfaces
US4521329A (en) * 1983-06-20 1985-06-04 E. I. Du Pont De Nemours And Company Copper conductor compositions
US4775439A (en) * 1983-07-25 1988-10-04 Amoco Corporation Method of making high metal content circuit patterns on plastic boards
US4714570A (en) * 1984-07-17 1987-12-22 Matsushita Electric Industrial Co., Ltd. Conductor paste and method of manufacturing a multilayered ceramic body using the paste
US4599277A (en) * 1984-10-09 1986-07-08 International Business Machines Corp. Control of the sintering of powdered metals
DE3537161C2 (de) * 1985-10-18 1995-08-03 Bosch Gmbh Robert Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik
US4623482A (en) * 1985-10-25 1986-11-18 Cts Corporation Copper conductive paint for porcelainized metal substrates
US4906404A (en) * 1988-11-07 1990-03-06 Dai-Ichi Kogyo Seiyaku Co., Ltd. Copper conductor composition
US5302412A (en) * 1989-02-03 1994-04-12 The Boc Group, Inc. Single atmosphere for firing compatible thick film material
US5334412A (en) * 1991-12-23 1994-08-02 Ferro Corporation Enamel for use on glass and a method of using the same
WO2003031373A2 (en) * 2001-10-09 2003-04-17 E. I. Du Pont De Nemours And Company Thick film conductor compositions for use on aluminum nitride substrates
US9351398B2 (en) * 2013-04-04 2016-05-24 GM Global Technology Operations LLC Thick film conductive inks for electronic devices
EP2804183B1 (en) * 2013-05-14 2019-04-17 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Brown-red cu-comprising composition and a composite comprising the brown-red cu-comprising composition
US9681559B2 (en) 2013-12-19 2017-06-13 GM Global Technology Operations LLC Thick film circuits with conductive components formed using different conductive elements and related methods
US10515737B2 (en) * 2017-10-12 2019-12-24 Korea Electronics Technology Institute Conductive paste composition, method for preparing the composition and electrode formed by the composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
US4122232A (en) * 1975-04-21 1978-10-24 Engelhard Minerals & Chemicals Corporation Air firable base metal conductors
US4082898A (en) * 1975-06-23 1978-04-04 Ppg Industries, Inc. Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates
US4072771A (en) * 1975-11-28 1978-02-07 Bala Electronics Corporation Copper thick film conductor
US4070517A (en) * 1976-07-08 1978-01-24 Beckman Instruments, Inc. Low fired conductive compositions
US4172919A (en) * 1977-04-22 1979-10-30 E. I. Du Pont De Nemours And Company Copper conductor compositions containing copper oxide and Bi2 O3
US4140817A (en) * 1977-11-04 1979-02-20 Bell Telephone Laboratories, Incorporated Thick film resistor circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894184A (en) * 1986-08-27 1990-01-16 The Furukawa Electric Co., Ltd. Low-temperature burnt conductive paste and method of manufacturing printed circuit board

Also Published As

Publication number Publication date
US4322316A (en) 1982-03-30
DE3167701D1 (en) 1985-01-24
EP0046640A1 (en) 1982-03-03
EP0046640B1 (en) 1984-12-12

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