JPS5754128Y2 - - Google Patents
Info
- Publication number
- JPS5754128Y2 JPS5754128Y2 JP1979095319U JP9531979U JPS5754128Y2 JP S5754128 Y2 JPS5754128 Y2 JP S5754128Y2 JP 1979095319 U JP1979095319 U JP 1979095319U JP 9531979 U JP9531979 U JP 9531979U JP S5754128 Y2 JPS5754128 Y2 JP S5754128Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979095319U JPS5754128Y2 (ja) | 1979-07-10 | 1979-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979095319U JPS5754128Y2 (ja) | 1979-07-10 | 1979-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5613282U JPS5613282U (ja) | 1981-02-04 |
| JPS5754128Y2 true JPS5754128Y2 (ja) | 1982-11-24 |
Family
ID=29328175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979095319U Expired JPS5754128Y2 (ja) | 1979-07-10 | 1979-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5754128Y2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0136808Y2 (ja) * | 1984-11-06 | 1989-11-08 | ||
| JP2629985B2 (ja) * | 1989-11-30 | 1997-07-16 | 岩崎電気株式会社 | 発光ダイオード |
| GB0216787D0 (en) * | 2002-07-19 | 2002-08-28 | Pilkington Plc | Laminated glazing panel |
-
1979
- 1979-07-10 JP JP1979095319U patent/JPS5754128Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5613282U (ja) | 1981-02-04 |