JPS5753955Y2 - - Google Patents
Info
- Publication number
- JPS5753955Y2 JPS5753955Y2 JP1974011574U JP1157474U JPS5753955Y2 JP S5753955 Y2 JPS5753955 Y2 JP S5753955Y2 JP 1974011574 U JP1974011574 U JP 1974011574U JP 1157474 U JP1157474 U JP 1157474U JP S5753955 Y2 JPS5753955 Y2 JP S5753955Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Details Of Fluid Heaters (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1974011574U JPS5753955Y2 (enrdf_load_stackoverflow) | 1974-01-25 | 1974-01-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1974011574U JPS5753955Y2 (enrdf_load_stackoverflow) | 1974-01-25 | 1974-01-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50101960U JPS50101960U (enrdf_load_stackoverflow) | 1975-08-22 |
JPS5753955Y2 true JPS5753955Y2 (enrdf_load_stackoverflow) | 1982-11-22 |
Family
ID=39111666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1974011574U Expired JPS5753955Y2 (enrdf_load_stackoverflow) | 1974-01-25 | 1974-01-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5753955Y2 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4840475A (enrdf_load_stackoverflow) * | 1971-09-21 | 1973-06-14 | ||
JPS48107067U (enrdf_load_stackoverflow) * | 1972-03-17 | 1973-12-12 |
-
1974
- 1974-01-25 JP JP1974011574U patent/JPS5753955Y2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
US7238543B2 (en) | 2000-08-25 | 2007-07-03 | Micron Technology, Inc. | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties |
US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
Also Published As
Publication number | Publication date |
---|---|
JPS50101960U (enrdf_load_stackoverflow) | 1975-08-22 |