JPS5753664U - - Google Patents

Info

Publication number
JPS5753664U
JPS5753664U JP1980129435U JP12943580U JPS5753664U JP S5753664 U JPS5753664 U JP S5753664U JP 1980129435 U JP1980129435 U JP 1980129435U JP 12943580 U JP12943580 U JP 12943580U JP S5753664 U JPS5753664 U JP S5753664U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980129435U
Other versions
JPS62211Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980129435U priority Critical patent/JPS62211Y2/ja
Publication of JPS5753664U publication Critical patent/JPS5753664U/ja
Application granted granted Critical
Publication of JPS62211Y2 publication Critical patent/JPS62211Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1980129435U 1980-09-10 1980-09-10 Expired JPS62211Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980129435U JPS62211Y2 (ja) 1980-09-10 1980-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980129435U JPS62211Y2 (ja) 1980-09-10 1980-09-10

Publications (2)

Publication Number Publication Date
JPS5753664U true JPS5753664U (ja) 1982-03-29
JPS62211Y2 JPS62211Y2 (ja) 1987-01-07

Family

ID=29489786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980129435U Expired JPS62211Y2 (ja) 1980-09-10 1980-09-10

Country Status (1)

Country Link
JP (1) JPS62211Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61252673A (ja) * 1985-05-01 1986-11-10 Toshiba Corp 半導体発光表示装置
JP2011129947A (ja) * 2002-09-04 2011-06-30 Cree Inc 電力表面取り付けの発光ダイ・パッケージ
JP2013179202A (ja) * 2012-02-29 2013-09-09 Panasonic Corp 発光装置及び照明器具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557974U (ja) * 1978-07-01 1980-01-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557974U (ja) * 1978-07-01 1980-01-19

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61252673A (ja) * 1985-05-01 1986-11-10 Toshiba Corp 半導体発光表示装置
JP2011129947A (ja) * 2002-09-04 2011-06-30 Cree Inc 電力表面取り付けの発光ダイ・パッケージ
JP2013179202A (ja) * 2012-02-29 2013-09-09 Panasonic Corp 発光装置及び照明器具

Also Published As

Publication number Publication date
JPS62211Y2 (ja) 1987-01-07

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