JPS5751938B2 - - Google Patents
Info
- Publication number
- JPS5751938B2 JPS5751938B2 JP51138664A JP13866476A JPS5751938B2 JP S5751938 B2 JPS5751938 B2 JP S5751938B2 JP 51138664 A JP51138664 A JP 51138664A JP 13866476 A JP13866476 A JP 13866476A JP S5751938 B2 JPS5751938 B2 JP S5751938B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
- Reciprocating Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13866476A JPS5363868A (en) | 1976-11-18 | 1976-11-18 | Ultrasonic wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13866476A JPS5363868A (en) | 1976-11-18 | 1976-11-18 | Ultrasonic wire bonding device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56211571A Division JPS5850023B2 (ja) | 1981-12-30 | 1981-12-30 | 超音波ワイヤボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5363868A JPS5363868A (en) | 1978-06-07 |
| JPS5751938B2 true JPS5751938B2 (fr) | 1982-11-05 |
Family
ID=15227239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13866476A Granted JPS5363868A (en) | 1976-11-18 | 1976-11-18 | Ultrasonic wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5363868A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4759073A (en) * | 1985-11-15 | 1988-07-19 | Kulicke & Soffa Industries, Inc. | Bonding apparatus with means and method for automatic calibration using pattern recognition |
-
1976
- 1976-11-18 JP JP13866476A patent/JPS5363868A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5363868A (en) | 1978-06-07 |