JPS5750739Y2 - - Google Patents

Info

Publication number
JPS5750739Y2
JPS5750739Y2 JP1977176915U JP17691577U JPS5750739Y2 JP S5750739 Y2 JPS5750739 Y2 JP S5750739Y2 JP 1977176915 U JP1977176915 U JP 1977176915U JP 17691577 U JP17691577 U JP 17691577U JP S5750739 Y2 JPS5750739 Y2 JP S5750739Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977176915U
Other languages
Japanese (ja)
Other versions
JPS54103155U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977176915U priority Critical patent/JPS5750739Y2/ja
Publication of JPS54103155U publication Critical patent/JPS54103155U/ja
Application granted granted Critical
Publication of JPS5750739Y2 publication Critical patent/JPS5750739Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977176915U 1977-12-28 1977-12-28 Expired JPS5750739Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977176915U JPS5750739Y2 (enExample) 1977-12-28 1977-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977176915U JPS5750739Y2 (enExample) 1977-12-28 1977-12-28

Publications (2)

Publication Number Publication Date
JPS54103155U JPS54103155U (enExample) 1979-07-20
JPS5750739Y2 true JPS5750739Y2 (enExample) 1982-11-06

Family

ID=29185907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977176915U Expired JPS5750739Y2 (enExample) 1977-12-28 1977-12-28

Country Status (1)

Country Link
JP (1) JPS5750739Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5223248U (enExample) * 1975-08-08 1977-02-18

Also Published As

Publication number Publication date
JPS54103155U (enExample) 1979-07-20

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