JPS5750071B2 - - Google Patents
Info
- Publication number
- JPS5750071B2 JPS5750071B2 JP49123776A JP12377674A JPS5750071B2 JP S5750071 B2 JPS5750071 B2 JP S5750071B2 JP 49123776 A JP49123776 A JP 49123776A JP 12377674 A JP12377674 A JP 12377674A JP S5750071 B2 JPS5750071 B2 JP S5750071B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49123776A JPS5750071B2 (de) | 1974-10-25 | 1974-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49123776A JPS5750071B2 (de) | 1974-10-25 | 1974-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5149684A JPS5149684A (de) | 1976-04-30 |
| JPS5750071B2 true JPS5750071B2 (de) | 1982-10-25 |
Family
ID=14868987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49123776A Expired JPS5750071B2 (de) | 1974-10-25 | 1974-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5750071B2 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2634672B2 (ja) * | 1989-07-13 | 1997-07-30 | 日東電工株式会社 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826973A (de) * | 1971-08-10 | 1973-04-09 |
-
1974
- 1974-10-25 JP JP49123776A patent/JPS5750071B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826973A (de) * | 1971-08-10 | 1973-04-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5149684A (de) | 1976-04-30 |