JPS5750069B2 - - Google Patents
Info
- Publication number
- JPS5750069B2 JPS5750069B2 JP49098721A JP9872174A JPS5750069B2 JP S5750069 B2 JPS5750069 B2 JP S5750069B2 JP 49098721 A JP49098721 A JP 49098721A JP 9872174 A JP9872174 A JP 9872174A JP S5750069 B2 JPS5750069 B2 JP S5750069B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49098721A JPS5750069B2 (en:Method) | 1974-08-27 | 1974-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49098721A JPS5750069B2 (en:Method) | 1974-08-27 | 1974-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5125965A JPS5125965A (en:Method) | 1976-03-03 |
| JPS5750069B2 true JPS5750069B2 (en:Method) | 1982-10-25 |
Family
ID=14227371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49098721A Expired JPS5750069B2 (en:Method) | 1974-08-27 | 1974-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5750069B2 (en:Method) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02102553A (ja) * | 1988-10-12 | 1990-04-16 | Nec Corp | 集積回路装置 |
| EP0413542A3 (en) * | 1989-08-15 | 1991-12-04 | Texas Instruments Incorporated | Direct mount semiconductor package |
| JPH0455569U (en:Method) * | 1990-09-17 | 1992-05-13 | ||
| JPH0455568U (en:Method) * | 1990-09-17 | 1992-05-13 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834672A (en:Method) * | 1971-09-07 | 1973-05-21 |
-
1974
- 1974-08-27 JP JP49098721A patent/JPS5750069B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5125965A (en:Method) | 1976-03-03 |