JPS5750069B2 - - Google Patents

Info

Publication number
JPS5750069B2
JPS5750069B2 JP49098721A JP9872174A JPS5750069B2 JP S5750069 B2 JPS5750069 B2 JP S5750069B2 JP 49098721 A JP49098721 A JP 49098721A JP 9872174 A JP9872174 A JP 9872174A JP S5750069 B2 JPS5750069 B2 JP S5750069B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49098721A
Other languages
Japanese (ja)
Other versions
JPS5125965A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49098721A priority Critical patent/JPS5750069B2/ja
Publication of JPS5125965A publication Critical patent/JPS5125965A/ja
Publication of JPS5750069B2 publication Critical patent/JPS5750069B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP49098721A 1974-08-27 1974-08-27 Expired JPS5750069B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49098721A JPS5750069B2 (enrdf_load_html_response) 1974-08-27 1974-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49098721A JPS5750069B2 (enrdf_load_html_response) 1974-08-27 1974-08-27

Publications (2)

Publication Number Publication Date
JPS5125965A JPS5125965A (enrdf_load_html_response) 1976-03-03
JPS5750069B2 true JPS5750069B2 (enrdf_load_html_response) 1982-10-25

Family

ID=14227371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49098721A Expired JPS5750069B2 (enrdf_load_html_response) 1974-08-27 1974-08-27

Country Status (1)

Country Link
JP (1) JPS5750069B2 (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102553A (ja) * 1988-10-12 1990-04-16 Nec Corp 集積回路装置
EP0413542A3 (en) * 1989-08-15 1991-12-04 Texas Instruments Incorporated Direct mount semiconductor package
JPH0455568U (enrdf_load_html_response) * 1990-09-17 1992-05-13
JPH0455569U (enrdf_load_html_response) * 1990-09-17 1992-05-13

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834672A (enrdf_load_html_response) * 1971-09-07 1973-05-21

Also Published As

Publication number Publication date
JPS5125965A (enrdf_load_html_response) 1976-03-03

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