JPS5750063B2 - - Google Patents
Info
- Publication number
- JPS5750063B2 JPS5750063B2 JP54098380A JP9838079A JPS5750063B2 JP S5750063 B2 JPS5750063 B2 JP S5750063B2 JP 54098380 A JP54098380 A JP 54098380A JP 9838079 A JP9838079 A JP 9838079A JP S5750063 B2 JPS5750063 B2 JP S5750063B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/473—
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9838079A JPS5623762A (en) | 1979-07-31 | 1979-07-31 | Epoxy resin composition for sealing semiconductor |
| US06/127,719 US4271061A (en) | 1979-03-06 | 1980-03-06 | Epoxy resin compositions for sealing semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9838079A JPS5623762A (en) | 1979-07-31 | 1979-07-31 | Epoxy resin composition for sealing semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5623762A JPS5623762A (en) | 1981-03-06 |
| JPS5750063B2 true JPS5750063B2 (Direct) | 1982-10-25 |
Family
ID=14218259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9838079A Granted JPS5623762A (en) | 1979-03-06 | 1979-07-31 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5623762A (Direct) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124558U (Direct) * | 1986-01-30 | 1987-08-07 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0749469B2 (ja) * | 1988-04-28 | 1995-05-31 | ソマール株式会社 | 含浸に好適なエポキシ樹脂組成物 |
| JP7785704B2 (ja) * | 2020-06-22 | 2025-12-15 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー | 光硬化性組成物 |
-
1979
- 1979-07-31 JP JP9838079A patent/JPS5623762A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124558U (Direct) * | 1986-01-30 | 1987-08-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5623762A (en) | 1981-03-06 |