JPS5747308A - Pressure sensitive adhesives - Google Patents

Pressure sensitive adhesives

Info

Publication number
JPS5747308A
JPS5747308A JP9258980A JP9258980A JPS5747308A JP S5747308 A JPS5747308 A JP S5747308A JP 9258980 A JP9258980 A JP 9258980A JP 9258980 A JP9258980 A JP 9258980A JP S5747308 A JPS5747308 A JP S5747308A
Authority
JP
Japan
Prior art keywords
pressure sensitive
sensitive adhesives
adhesives
pressure
sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9258980A
Other languages
Japanese (ja)
Inventor
Ii Gurenon Arufuretsudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INT KOOTEINGUSU CO Inc
INTERNATIONAL KOOTEINGUSU CO Inc
SEBUNEMU KOOTENGUSUUAKADEMII O
SEBUNEMU KOOTENGUSUUAKADEMII OBU APURAIDO SAIENSU
Original Assignee
INT KOOTEINGUSU CO Inc
INTERNATIONAL KOOTEINGUSU CO Inc
SEBUNEMU KOOTENGUSUUAKADEMII O
SEBUNEMU KOOTENGUSUUAKADEMII OBU APURAIDO SAIENSU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INT KOOTEINGUSU CO Inc, INTERNATIONAL KOOTEINGUSU CO Inc, SEBUNEMU KOOTENGUSUUAKADEMII O, SEBUNEMU KOOTENGUSUUAKADEMII OBU APURAIDO SAIENSU filed Critical INT KOOTEINGUSU CO Inc
Priority to JP9258980A priority Critical patent/JPS5747308A/en
Publication of JPS5747308A publication Critical patent/JPS5747308A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
JP9258980A 1980-07-07 1980-07-07 Pressure sensitive adhesives Pending JPS5747308A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9258980A JPS5747308A (en) 1980-07-07 1980-07-07 Pressure sensitive adhesives

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9258980A JPS5747308A (en) 1980-07-07 1980-07-07 Pressure sensitive adhesives

Publications (1)

Publication Number Publication Date
JPS5747308A true JPS5747308A (en) 1982-03-18

Family

ID=14058625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9258980A Pending JPS5747308A (en) 1980-07-07 1980-07-07 Pressure sensitive adhesives

Country Status (1)

Country Link
JP (1) JPS5747308A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0247182A (en) * 1988-06-28 1990-02-16 Minnesota Mining & Mfg Co <3M> Pressure-sensitive adhesive
JPH04320471A (en) * 1991-04-19 1992-11-11 Nitto Denko Corp Photopolymerizable adhesive composition, pressure-sensitive adhesive prepared by using the same, and adhesive sheet coated therewith
JPH05271624A (en) * 1992-03-27 1993-10-19 Nitto Denko Corp Pressure-sensitive adhesive excellent in heat resistance, adhesive sheet comprising the same, and their production
JPH05271623A (en) * 1992-03-27 1993-10-19 Nitto Denko Corp Pressure-sensitive adhesive and adhesive sheet comprising the same
JPH06340849A (en) * 1993-04-28 1994-12-13 Nippon Zeon Co Ltd Ultraviolet-curing composition, method of bonding therewith and product bonded therewith
JPH0790228A (en) * 1993-04-28 1995-04-04 Nippon Zeon Co Ltd Ultraviolet-curable composition, bonding method using the composition and bonded product
JPH09111218A (en) * 1995-10-16 1997-04-28 Asahi Chem Ind Co Ltd Emulsion composition for adhesive and its production
JP2002145917A (en) * 2000-08-28 2002-05-22 Sekisui Chem Co Ltd Photopolymerization method, photopolymerizable composition, photopolymerization product and adhesive tape
WO2017061545A1 (en) * 2015-10-07 2017-04-13 積水化学工業株式会社 Poly(vinyl acetal) resin composition, adhesive sheet, interlaminar filling material for touch panel, and laminate
JP2017106015A (en) * 2015-12-08 2017-06-15 積水化学工業株式会社 Styrenic elastomer resin composition, photo-crosslinked article of styrenic elastomer resin composition, heat resistant adhesive film, surface protective film and manufacturing method of heat resistant adhesive film
JP2018031009A (en) * 2011-03-25 2018-03-01 アデジフ エ コンポジットゥ ポリメールＡｄｈｅｓｉｆｓ Ｅｔ Ｃｏｍｐｏｓｉｔｅｓ Ｐｏｌｙｍｅｒｓ Structural adhesive, preparation procedure of the same, and application of the same
WO2018079608A1 (en) * 2016-10-28 2018-05-03 日立化成株式会社 Curable composition for forming elastic resin layer

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0247182A (en) * 1988-06-28 1990-02-16 Minnesota Mining & Mfg Co <3M> Pressure-sensitive adhesive
JPH04320471A (en) * 1991-04-19 1992-11-11 Nitto Denko Corp Photopolymerizable adhesive composition, pressure-sensitive adhesive prepared by using the same, and adhesive sheet coated therewith
JPH05271624A (en) * 1992-03-27 1993-10-19 Nitto Denko Corp Pressure-sensitive adhesive excellent in heat resistance, adhesive sheet comprising the same, and their production
JPH05271623A (en) * 1992-03-27 1993-10-19 Nitto Denko Corp Pressure-sensitive adhesive and adhesive sheet comprising the same
JPH06340849A (en) * 1993-04-28 1994-12-13 Nippon Zeon Co Ltd Ultraviolet-curing composition, method of bonding therewith and product bonded therewith
JPH0790228A (en) * 1993-04-28 1995-04-04 Nippon Zeon Co Ltd Ultraviolet-curable composition, bonding method using the composition and bonded product
JPH09111218A (en) * 1995-10-16 1997-04-28 Asahi Chem Ind Co Ltd Emulsion composition for adhesive and its production
JP2002145917A (en) * 2000-08-28 2002-05-22 Sekisui Chem Co Ltd Photopolymerization method, photopolymerizable composition, photopolymerization product and adhesive tape
JP2018031009A (en) * 2011-03-25 2018-03-01 アデジフ エ コンポジットゥ ポリメールＡｄｈｅｓｉｆｓ Ｅｔ Ｃｏｍｐｏｓｉｔｅｓ Ｐｏｌｙｍｅｒｓ Structural adhesive, preparation procedure of the same, and application of the same
WO2017061545A1 (en) * 2015-10-07 2017-04-13 積水化学工業株式会社 Poly(vinyl acetal) resin composition, adhesive sheet, interlaminar filling material for touch panel, and laminate
JPWO2017061545A1 (en) * 2015-10-07 2018-07-26 積水化学工業株式会社 Polyvinyl acetal resin composition, adhesive sheet, interlayer filling material for touch panel, and laminate
JP2017106015A (en) * 2015-12-08 2017-06-15 積水化学工業株式会社 Styrenic elastomer resin composition, photo-crosslinked article of styrenic elastomer resin composition, heat resistant adhesive film, surface protective film and manufacturing method of heat resistant adhesive film
WO2018079608A1 (en) * 2016-10-28 2018-05-03 日立化成株式会社 Curable composition for forming elastic resin layer
CN109863180A (en) * 2016-10-28 2019-06-07 日立化成株式会社 Solidification compound is used in the formation of retractility resin layer
JPWO2018079608A1 (en) * 2016-10-28 2019-09-19 日立化成株式会社 Curable composition for forming elastic resin layer
TWI749089B (en) * 2016-10-28 2021-12-11 日商昭和電工材料股份有限公司 Curable composition for forming stretchable resin layer

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