JPS5746605Y2 - - Google Patents

Info

Publication number
JPS5746605Y2
JPS5746605Y2 JP1977109851U JP10985177U JPS5746605Y2 JP S5746605 Y2 JPS5746605 Y2 JP S5746605Y2 JP 1977109851 U JP1977109851 U JP 1977109851U JP 10985177 U JP10985177 U JP 10985177U JP S5746605 Y2 JPS5746605 Y2 JP S5746605Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977109851U
Other languages
Japanese (ja)
Other versions
JPS5435859U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977109851U priority Critical patent/JPS5746605Y2/ja
Publication of JPS5435859U publication Critical patent/JPS5435859U/ja
Application granted granted Critical
Publication of JPS5746605Y2 publication Critical patent/JPS5746605Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1977109851U 1977-08-16 1977-08-16 Expired JPS5746605Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977109851U JPS5746605Y2 (enExample) 1977-08-16 1977-08-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977109851U JPS5746605Y2 (enExample) 1977-08-16 1977-08-16

Publications (2)

Publication Number Publication Date
JPS5435859U JPS5435859U (enExample) 1979-03-08
JPS5746605Y2 true JPS5746605Y2 (enExample) 1982-10-14

Family

ID=29056183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977109851U Expired JPS5746605Y2 (enExample) 1977-08-16 1977-08-16

Country Status (1)

Country Link
JP (1) JPS5746605Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754278Y2 (enExample) * 1977-10-18 1982-11-24
JPS5689068U (enExample) * 1979-12-12 1981-07-16

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285470A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Lead frame fixing jig for wire bonding

Also Published As

Publication number Publication date
JPS5435859U (enExample) 1979-03-08

Similar Documents

Publication Publication Date Title
FR2378804B1 (enExample)
FR2378140B1 (enExample)
DE2838537C3 (enExample)
CH643422B (enExample)
DK140303C (enExample)
FR2378345B1 (enExample)
FR2376902B1 (enExample)
FR2379049B1 (enExample)
FR2376795B3 (enExample)
FR2378477B1 (enExample)
FR2378795B1 (enExample)
FR2378012B1 (enExample)
JPS5746605Y2 (enExample)
FR2378248B1 (enExample)
JPS5754278Y2 (enExample)
FR2378842B1 (enExample)
BG25852A1 (enExample)
BE868323A (enExample)
CH607735A5 (enExample)
BG25860A1 (enExample)
BG25855A1 (enExample)
BG25853A1 (enExample)
BG25839A1 (enExample)
BG25851A1 (enExample)
BG25850A1 (enExample)