JPS5745959Y2 - - Google Patents

Info

Publication number
JPS5745959Y2
JPS5745959Y2 JP1980057921U JP5792180U JPS5745959Y2 JP S5745959 Y2 JPS5745959 Y2 JP S5745959Y2 JP 1980057921 U JP1980057921 U JP 1980057921U JP 5792180 U JP5792180 U JP 5792180U JP S5745959 Y2 JPS5745959 Y2 JP S5745959Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980057921U
Other versions
JPS56159037U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980057921U priority Critical patent/JPS5745959Y2/ja
Publication of JPS56159037U publication Critical patent/JPS56159037U/ja
Application granted granted Critical
Publication of JPS5745959Y2 publication Critical patent/JPS5745959Y2/ja
Application status is Granted legal-status Critical

Links

JP1980057921U 1980-04-25 1980-04-25 Granted JPS5745959Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980057921U JPS5745959Y2 (en) 1980-04-25 1980-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980057921U JPS5745959Y2 (en) 1980-04-25 1980-04-25

Publications (2)

Publication Number Publication Date
JPS56159037U JPS56159037U (en) 1981-11-27
JPS5745959Y2 true JPS5745959Y2 (en) 1982-10-09

Family

ID=29652404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980057921U Granted JPS5745959Y2 (en) 1980-04-25 1980-04-25

Country Status (1)

Country Link
JP (1) JPS5745959Y2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636448U (en) * 1979-08-29 1981-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636448U (en) * 1979-08-29 1981-04-08

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode

Also Published As

Publication number Publication date
JPS56159037U (en) 1981-11-27

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