JPS5745959Y2 - - Google Patents
Info
- Publication number
- JPS5745959Y2 JPS5745959Y2 JP1980057921U JP5792180U JPS5745959Y2 JP S5745959 Y2 JPS5745959 Y2 JP S5745959Y2 JP 1980057921 U JP1980057921 U JP 1980057921U JP 5792180 U JP5792180 U JP 5792180U JP S5745959 Y2 JPS5745959 Y2 JP S5745959Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980057921U JPS5745959Y2 (en) | 1980-04-25 | 1980-04-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980057921U JPS5745959Y2 (en) | 1980-04-25 | 1980-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56159037U JPS56159037U (en) | 1981-11-27 |
JPS5745959Y2 true JPS5745959Y2 (en) | 1982-10-09 |
Family
ID=29652404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980057921U Expired JPS5745959Y2 (en) | 1980-04-25 | 1980-04-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5745959Y2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
US9362210B2 (en) | 2000-04-27 | 2016-06-07 | Amkor Technology, Inc. | Leadframe and semiconductor package made using the leadframe |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5636448U (en) * | 1979-08-29 | 1981-04-08 |
-
1980
- 1980-04-25 JP JP1980057921U patent/JPS5745959Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5636448U (en) * | 1979-08-29 | 1981-04-08 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9362210B2 (en) | 2000-04-27 | 2016-06-07 | Amkor Technology, Inc. | Leadframe and semiconductor package made using the leadframe |
US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
US8952522B1 (en) | 2002-11-08 | 2015-02-10 | Amkor Technology, Inc. | Wafer level package and fabrication method |
US9406645B1 (en) | 2002-11-08 | 2016-08-02 | Amkor Technology, Inc. | Wafer level package and fabrication method |
US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
Also Published As
Publication number | Publication date |
---|---|
JPS56159037U (en) | 1981-11-27 |