JPS5745060B2 - - Google Patents
Info
- Publication number
- JPS5745060B2 JPS5745060B2 JP2220880A JP2220880A JPS5745060B2 JP S5745060 B2 JPS5745060 B2 JP S5745060B2 JP 2220880 A JP2220880 A JP 2220880A JP 2220880 A JP2220880 A JP 2220880A JP S5745060 B2 JPS5745060 B2 JP S5745060B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2220880A JPS56120133A (en) | 1980-02-26 | 1980-02-26 | Gettering process method using the bending of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2220880A JPS56120133A (en) | 1980-02-26 | 1980-02-26 | Gettering process method using the bending of substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56120133A JPS56120133A (en) | 1981-09-21 |
| JPS5745060B2 true JPS5745060B2 (en) | 1982-09-25 |
Family
ID=12076370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2220880A Granted JPS56120133A (en) | 1980-02-26 | 1980-02-26 | Gettering process method using the bending of substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56120133A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6746230B2 (en) * | 2016-12-09 | 2020-08-26 | 株式会社ディスコ | Wafer manufacturing method |
-
1980
- 1980-02-26 JP JP2220880A patent/JPS56120133A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56120133A (en) | 1981-09-21 |