JPS5744556U - - Google Patents
Info
- Publication number
- JPS5744556U JPS5744556U JP1980004152U JP415280U JPS5744556U JP S5744556 U JPS5744556 U JP S5744556U JP 1980004152 U JP1980004152 U JP 1980004152U JP 415280 U JP415280 U JP 415280U JP S5744556 U JPS5744556 U JP S5744556U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980004152U JPS6214705Y2 (en:Method) | 1980-01-17 | 1980-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980004152U JPS6214705Y2 (en:Method) | 1980-01-17 | 1980-01-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5744556U true JPS5744556U (en:Method) | 1982-03-11 |
| JPS6214705Y2 JPS6214705Y2 (en:Method) | 1987-04-15 |
Family
ID=29434483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980004152U Expired JPS6214705Y2 (en:Method) | 1980-01-17 | 1980-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214705Y2 (en:Method) |
-
1980
- 1980-01-17 JP JP1980004152U patent/JPS6214705Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6214705Y2 (en:Method) | 1987-04-15 |