JPS574428Y2 - - Google Patents
Info
- Publication number
- JPS574428Y2 JPS574428Y2 JP1974147853U JP14785374U JPS574428Y2 JP S574428 Y2 JPS574428 Y2 JP S574428Y2 JP 1974147853 U JP1974147853 U JP 1974147853U JP 14785374 U JP14785374 U JP 14785374U JP S574428 Y2 JPS574428 Y2 JP S574428Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974147853U JPS574428Y2 (https=) | 1974-12-05 | 1974-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974147853U JPS574428Y2 (https=) | 1974-12-05 | 1974-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5173977U JPS5173977U (https=) | 1976-06-10 |
| JPS574428Y2 true JPS574428Y2 (https=) | 1982-01-27 |
Family
ID=28438958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974147853U Expired JPS574428Y2 (https=) | 1974-12-05 | 1974-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS574428Y2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120781Y2 (https=) * | 1980-06-13 | 1986-06-21 | ||
| JPS57107083A (en) * | 1980-12-25 | 1982-07-03 | Fujitsu Ltd | Photoelectric converter |
| JPS57159063A (en) * | 1981-03-27 | 1982-10-01 | Hitachi Ltd | Transistor |
-
1974
- 1974-12-05 JP JP1974147853U patent/JPS574428Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5173977U (https=) | 1976-06-10 |