JPS5743496U - - Google Patents
Info
- Publication number
- JPS5743496U JPS5743496U JP12100580U JP12100580U JPS5743496U JP S5743496 U JPS5743496 U JP S5743496U JP 12100580 U JP12100580 U JP 12100580U JP 12100580 U JP12100580 U JP 12100580U JP S5743496 U JPS5743496 U JP S5743496U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Digital Computer Display Output (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12100580U JPS636759Y2 (en:Method) | 1980-08-25 | 1980-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12100580U JPS636759Y2 (en:Method) | 1980-08-25 | 1980-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5743496U true JPS5743496U (en:Method) | 1982-03-10 |
| JPS636759Y2 JPS636759Y2 (en:Method) | 1988-02-26 |
Family
ID=29481687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12100580U Expired JPS636759Y2 (en:Method) | 1980-08-25 | 1980-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636759Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009501431A (ja) * | 2005-07-15 | 2009-01-15 | パナソニック株式会社 | 発光モジュール及びこれに用いる実装基板 |
| JP2009302542A (ja) * | 2008-06-13 | 2009-12-24 | Samsung Electronics Co Ltd | 発光素子、発光素子を含む発光装置、発光素子の製造方法および発光素子を含む発光装置の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9722160B2 (en) | 2014-10-31 | 2017-08-01 | Nichia Corporation | Light emitting device and adaptive driving beam headlamp system |
-
1980
- 1980-08-25 JP JP12100580U patent/JPS636759Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009501431A (ja) * | 2005-07-15 | 2009-01-15 | パナソニック株式会社 | 発光モジュール及びこれに用いる実装基板 |
| JP2009302542A (ja) * | 2008-06-13 | 2009-12-24 | Samsung Electronics Co Ltd | 発光素子、発光素子を含む発光装置、発光素子の製造方法および発光素子を含む発光装置の製造方法 |
| US8975656B2 (en) | 2008-06-13 | 2015-03-10 | Samsung Electronics Co., Ltd. | Light emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636759Y2 (en:Method) | 1988-02-26 |