JPS5742992B2 - - Google Patents

Info

Publication number
JPS5742992B2
JPS5742992B2 JP9881181A JP9881181A JPS5742992B2 JP S5742992 B2 JPS5742992 B2 JP S5742992B2 JP 9881181 A JP9881181 A JP 9881181A JP 9881181 A JP9881181 A JP 9881181A JP S5742992 B2 JPS5742992 B2 JP S5742992B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9881181A
Other languages
Japanese (ja)
Other versions
JPS5743489A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9881181A priority Critical patent/JPS5743489A/ja
Publication of JPS5743489A publication Critical patent/JPS5743489A/ja
Publication of JPS5742992B2 publication Critical patent/JPS5742992B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119Arrangement of the bump connectors prior to mounting
    • H01L2224/81191Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9881181A 1981-06-25 1981-06-25 Method of producing cirucit board Granted JPS5743489A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9881181A JPS5743489A (en) 1981-06-25 1981-06-25 Method of producing cirucit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9881181A JPS5743489A (en) 1981-06-25 1981-06-25 Method of producing cirucit board

Publications (2)

Publication Number Publication Date
JPS5743489A JPS5743489A (en) 1982-03-11
JPS5742992B2 true JPS5742992B2 (enrdf_load_html_response) 1982-09-11

Family

ID=14229708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9881181A Granted JPS5743489A (en) 1981-06-25 1981-06-25 Method of producing cirucit board

Country Status (1)

Country Link
JP (1) JPS5743489A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180039686A (ko) 2015-09-16 2018-04-18 제이에프이 스틸 가부시키가이샤 슬라브 주편의 연속 주조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217432A (ja) * 1985-03-22 1986-09-27 Kawasaki Heavy Ind Ltd 流動層装置の搬送管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180039686A (ko) 2015-09-16 2018-04-18 제이에프이 스틸 가부시키가이샤 슬라브 주편의 연속 주조 방법

Also Published As

Publication number Publication date
JPS5743489A (en) 1982-03-11

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