JPS5742918U - - Google Patents
Info
- Publication number
- JPS5742918U JPS5742918U JP12087880U JP12087880U JPS5742918U JP S5742918 U JPS5742918 U JP S5742918U JP 12087880 U JP12087880 U JP 12087880U JP 12087880 U JP12087880 U JP 12087880U JP S5742918 U JPS5742918 U JP S5742918U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Instrument Panels (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12087880U JPS5742918U (en) | 1980-08-26 | 1980-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12087880U JPS5742918U (en) | 1980-08-26 | 1980-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5742918U true JPS5742918U (en) | 1982-03-09 |
Family
ID=29481552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12087880U Pending JPS5742918U (en) | 1980-08-26 | 1980-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5742918U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060800A (en) * | 1983-09-13 | 1985-04-08 | 日東電工株式会社 | Device for bonding ring to thin plate |
-
1980
- 1980-08-26 JP JP12087880U patent/JPS5742918U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060800A (en) * | 1983-09-13 | 1985-04-08 | 日東電工株式会社 | Device for bonding ring to thin plate |
| JPS6317738B2 (en) * | 1983-09-13 | 1988-04-14 | Nitto Electric Ind Co |