JPS5741655U - - Google Patents
Info
- Publication number
- JPS5741655U JPS5741655U JP1980119230U JP11923080U JPS5741655U JP S5741655 U JPS5741655 U JP S5741655U JP 1980119230 U JP1980119230 U JP 1980119230U JP 11923080 U JP11923080 U JP 11923080U JP S5741655 U JPS5741655 U JP S5741655U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980119230U JPS6125247Y2 (https=) | 1980-08-21 | 1980-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980119230U JPS6125247Y2 (https=) | 1980-08-21 | 1980-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5741655U true JPS5741655U (https=) | 1982-03-06 |
| JPS6125247Y2 JPS6125247Y2 (https=) | 1986-07-29 |
Family
ID=29479879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980119230U Expired JPS6125247Y2 (https=) | 1980-08-21 | 1980-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6125247Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158149A (ja) * | 1988-12-12 | 1990-06-18 | Hitachi Cable Ltd | 両面実装型ｔａｂ用テープキャリア |
-
1980
- 1980-08-21 JP JP1980119230U patent/JPS6125247Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158149A (ja) * | 1988-12-12 | 1990-06-18 | Hitachi Cable Ltd | 両面実装型ｔａｂ用テープキャリア |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6125247Y2 (https=) | 1986-07-29 |