JPS574115B2 - - Google Patents
Info
- Publication number
- JPS574115B2 JPS574115B2 JP5816276A JP5816276A JPS574115B2 JP S574115 B2 JPS574115 B2 JP S574115B2 JP 5816276 A JP5816276 A JP 5816276A JP 5816276 A JP5816276 A JP 5816276A JP S574115 B2 JPS574115 B2 JP S574115B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5816276A JPS52140862A (en) | 1976-05-19 | 1976-05-19 | Method of producing flexible printed circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5816276A JPS52140862A (en) | 1976-05-19 | 1976-05-19 | Method of producing flexible printed circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52140862A JPS52140862A (en) | 1977-11-24 |
| JPS574115B2 true JPS574115B2 (de) | 1982-01-25 |
Family
ID=13076285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5816276A Granted JPS52140862A (en) | 1976-05-19 | 1976-05-19 | Method of producing flexible printed circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52140862A (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017022237A (ja) * | 2015-07-09 | 2017-01-26 | 日東電工株式会社 | 配線回路基板 |
| JP2017022236A (ja) * | 2015-07-09 | 2017-01-26 | 日東電工株式会社 | 配線回路基板の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU4714001A (en) * | 1999-12-23 | 2001-07-03 | Oak-Mitsui Inc. | Method for applying polymer film to a metal foil |
-
1976
- 1976-05-19 JP JP5816276A patent/JPS52140862A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017022237A (ja) * | 2015-07-09 | 2017-01-26 | 日東電工株式会社 | 配線回路基板 |
| JP2017022236A (ja) * | 2015-07-09 | 2017-01-26 | 日東電工株式会社 | 配線回路基板の製造方法 |
| US10194861B2 (en) | 2015-07-09 | 2019-02-05 | Nitto Denko Corporation | Wired circuit board |
| US11006530B2 (en) | 2015-07-09 | 2021-05-11 | Nitto Denko Corporation | Producing method of wired circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52140862A (en) | 1977-11-24 |