JPS5740882U - - Google Patents
Info
- Publication number
- JPS5740882U JPS5740882U JP11453380U JP11453380U JPS5740882U JP S5740882 U JPS5740882 U JP S5740882U JP 11453380 U JP11453380 U JP 11453380U JP 11453380 U JP11453380 U JP 11453380U JP S5740882 U JPS5740882 U JP S5740882U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11453380U JPS5740882U (de) | 1980-08-14 | 1980-08-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11453380U JPS5740882U (de) | 1980-08-14 | 1980-08-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5740882U true JPS5740882U (de) | 1982-03-05 |
Family
ID=29475514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11453380U Pending JPS5740882U (de) | 1980-08-14 | 1980-08-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5740882U (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62293654A (ja) * | 1986-06-12 | 1987-12-21 | Furukawa Electric Co Ltd:The | 半導体用ヒ−トパイプ冷却器およびその製造方法 |
WO1990009037A1 (en) * | 1989-02-06 | 1990-08-09 | The Furukawa Electric Co., Ltd. | Electrically insulated heat pipe-type semiconductor cooling device |
JP2018169106A (ja) * | 2017-03-30 | 2018-11-01 | マツダ株式会社 | ヒートパイプ装置 |
-
1980
- 1980-08-14 JP JP11453380U patent/JPS5740882U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62293654A (ja) * | 1986-06-12 | 1987-12-21 | Furukawa Electric Co Ltd:The | 半導体用ヒ−トパイプ冷却器およびその製造方法 |
WO1990009037A1 (en) * | 1989-02-06 | 1990-08-09 | The Furukawa Electric Co., Ltd. | Electrically insulated heat pipe-type semiconductor cooling device |
JP2018169106A (ja) * | 2017-03-30 | 2018-11-01 | マツダ株式会社 | ヒートパイプ装置 |