JPS5740587B2 - - Google Patents
Info
- Publication number
- JPS5740587B2 JPS5740587B2 JP14091977A JP14091977A JPS5740587B2 JP S5740587 B2 JPS5740587 B2 JP S5740587B2 JP 14091977 A JP14091977 A JP 14091977A JP 14091977 A JP14091977 A JP 14091977A JP S5740587 B2 JPS5740587 B2 JP S5740587B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14091977A JPS5473529A (en) | 1977-11-24 | 1977-11-24 | Bonding pad forming method for bubble memory chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14091977A JPS5473529A (en) | 1977-11-24 | 1977-11-24 | Bonding pad forming method for bubble memory chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5473529A JPS5473529A (en) | 1979-06-12 |
| JPS5740587B2 true JPS5740587B2 (cs) | 1982-08-28 |
Family
ID=15279858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14091977A Granted JPS5473529A (en) | 1977-11-24 | 1977-11-24 | Bonding pad forming method for bubble memory chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5473529A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892242A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | セラミツク多層基板 |
-
1977
- 1977-11-24 JP JP14091977A patent/JPS5473529A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5473529A (en) | 1979-06-12 |