JPS5739557B2 - - Google Patents
Info
- Publication number
- JPS5739557B2 JPS5739557B2 JP50117717A JP11771775A JPS5739557B2 JP S5739557 B2 JPS5739557 B2 JP S5739557B2 JP 50117717 A JP50117717 A JP 50117717A JP 11771775 A JP11771775 A JP 11771775A JP S5739557 B2 JPS5739557 B2 JP S5739557B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50117717A JPS5242259A (en) | 1975-10-01 | 1975-10-01 | Method of partially plating multiilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50117717A JPS5242259A (en) | 1975-10-01 | 1975-10-01 | Method of partially plating multiilayer printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5242259A JPS5242259A (en) | 1977-04-01 |
JPS5739557B2 true JPS5739557B2 (fi) | 1982-08-21 |
Family
ID=14718538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50117717A Granted JPS5242259A (en) | 1975-10-01 | 1975-10-01 | Method of partially plating multiilayer printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5242259A (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4812113B2 (ja) * | 2007-02-21 | 2011-11-09 | 日本航空電子工業株式会社 | 基板用コネクタ |
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1975
- 1975-10-01 JP JP50117717A patent/JPS5242259A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5242259A (en) | 1977-04-01 |