JPS5738032B2 - - Google Patents

Info

Publication number
JPS5738032B2
JPS5738032B2 JP2622581A JP2622581A JPS5738032B2 JP S5738032 B2 JPS5738032 B2 JP S5738032B2 JP 2622581 A JP2622581 A JP 2622581A JP 2622581 A JP2622581 A JP 2622581A JP S5738032 B2 JPS5738032 B2 JP S5738032B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2622581A
Other languages
Japanese (ja)
Other versions
JPS56133862A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56133862A publication Critical patent/JPS56133862A/ja
Publication of JPS5738032B2 publication Critical patent/JPS5738032B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
  • Battery Mounting, Suspending (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP2622581A 1980-02-26 1981-02-26 Stack module frame assembly Granted JPS56133862A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12468980A 1980-02-26 1980-02-26

Publications (2)

Publication Number Publication Date
JPS56133862A JPS56133862A (en) 1981-10-20
JPS5738032B2 true JPS5738032B2 (US20100012521A1-20100121-C00001.png) 1982-08-13

Family

ID=22416286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2622581A Granted JPS56133862A (en) 1980-02-26 1981-02-26 Stack module frame assembly

Country Status (6)

Country Link
JP (1) JPS56133862A (US20100012521A1-20100121-C00001.png)
KR (1) KR830005723A (US20100012521A1-20100121-C00001.png)
BR (1) BR8101069A (US20100012521A1-20100121-C00001.png)
ES (1) ES267972Y (US20100012521A1-20100121-C00001.png)
FR (1) FR2485263A1 (US20100012521A1-20100121-C00001.png)
IT (1) IT1168486B (US20100012521A1-20100121-C00001.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2529387B1 (fr) * 1982-06-29 1985-09-06 Jeumont Schneider Montage de pastilles semi-conductrices de puissance
CN108206152B (zh) * 2018-01-04 2021-05-18 许继集团有限公司 一种igbt取换方法及实施该方法的igbt取换装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50112736A (US20100012521A1-20100121-C00001.png) * 1974-02-20 1975-09-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50112736A (US20100012521A1-20100121-C00001.png) * 1974-02-20 1975-09-04

Also Published As

Publication number Publication date
BR8101069A (pt) 1981-09-01
JPS56133862A (en) 1981-10-20
IT8141537A1 (it) 1982-08-26
IT8141537A0 (it) 1981-02-26
ES267972U (es) 1983-05-01
ES267972Y (es) 1983-11-16
KR830005723A (ko) 1983-09-09
IT1168486B (it) 1987-05-20
FR2485263A1 (fr) 1981-12-24

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