JPS5738032B2 - - Google Patents
Info
- Publication number
- JPS5738032B2 JPS5738032B2 JP2622581A JP2622581A JPS5738032B2 JP S5738032 B2 JPS5738032 B2 JP S5738032B2 JP 2622581 A JP2622581 A JP 2622581A JP 2622581 A JP2622581 A JP 2622581A JP S5738032 B2 JPS5738032 B2 JP S5738032B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Die Bonding (AREA)
- Battery Mounting, Suspending (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12468980A | 1980-02-26 | 1980-02-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56133862A JPS56133862A (en) | 1981-10-20 |
JPS5738032B2 true JPS5738032B2 (US20100012521A1-20100121-C00001.png) | 1982-08-13 |
Family
ID=22416286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2622581A Granted JPS56133862A (en) | 1980-02-26 | 1981-02-26 | Stack module frame assembly |
Country Status (6)
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2529387B1 (fr) * | 1982-06-29 | 1985-09-06 | Jeumont Schneider | Montage de pastilles semi-conductrices de puissance |
CN108206152B (zh) * | 2018-01-04 | 2021-05-18 | 许继集团有限公司 | 一种igbt取换方法及实施该方法的igbt取换装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50112736A (US20100012521A1-20100121-C00001.png) * | 1974-02-20 | 1975-09-04 |
-
1981
- 1981-02-23 BR BR8101069A patent/BR8101069A/pt unknown
- 1981-02-26 KR KR1019810000640A patent/KR830005723A/ko unknown
- 1981-02-26 FR FR8103882A patent/FR2485263A1/fr not_active Withdrawn
- 1981-02-26 ES ES1981267972U patent/ES267972Y/es not_active Expired
- 1981-02-26 IT IT41537/81A patent/IT1168486B/it active
- 1981-02-26 JP JP2622581A patent/JPS56133862A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50112736A (US20100012521A1-20100121-C00001.png) * | 1974-02-20 | 1975-09-04 |
Also Published As
Publication number | Publication date |
---|---|
BR8101069A (pt) | 1981-09-01 |
JPS56133862A (en) | 1981-10-20 |
IT8141537A1 (it) | 1982-08-26 |
IT8141537A0 (it) | 1981-02-26 |
ES267972U (es) | 1983-05-01 |
ES267972Y (es) | 1983-11-16 |
KR830005723A (ko) | 1983-09-09 |
IT1168486B (it) | 1987-05-20 |
FR2485263A1 (fr) | 1981-12-24 |