JPS5734651B2 - - Google Patents

Info

Publication number
JPS5734651B2
JPS5734651B2 JP4463480A JP4463480A JPS5734651B2 JP S5734651 B2 JPS5734651 B2 JP S5734651B2 JP 4463480 A JP4463480 A JP 4463480A JP 4463480 A JP4463480 A JP 4463480A JP S5734651 B2 JPS5734651 B2 JP S5734651B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4463480A
Other languages
Japanese (ja)
Other versions
JPS55150233A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4463480A priority Critical patent/JPS55150233A/ja
Publication of JPS55150233A publication Critical patent/JPS55150233A/ja
Publication of JPS5734651B2 publication Critical patent/JPS5734651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP4463480A 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer Granted JPS55150233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4463480A JPS55150233A (en) 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4463480A JPS55150233A (en) 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3962572A Division JPS5546054B2 (US07202987-20070410-C00007.png) 1972-04-21 1972-04-21

Publications (2)

Publication Number Publication Date
JPS55150233A JPS55150233A (en) 1980-11-22
JPS5734651B2 true JPS5734651B2 (US07202987-20070410-C00007.png) 1982-07-24

Family

ID=12696852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4463480A Granted JPS55150233A (en) 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55150233A (US07202987-20070410-C00007.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268349U (US07202987-20070410-C00007.png) * 1985-10-17 1987-04-28

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007058876A1 (de) * 2007-12-06 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268349U (US07202987-20070410-C00007.png) * 1985-10-17 1987-04-28

Also Published As

Publication number Publication date
JPS55150233A (en) 1980-11-22

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